tag: Promex Industries

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jun, 2021 - Comments: 0

Fab tools TEL plans to ship its leading-edge coater/developer system to the joint Imec-ASML research lab, which is working on high-NA extreme ultraviolet (EUV) lithography. The equipment will be integrated with the EXE:5000, ASML’s next-generation high-NA EUV lithography system. The 0.55 numerical aperture (NA) tool is slated to be operational in 2023. Today's EUV is in production, but there... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Rethinking Business As Usual
By Rosie Medina - 20 May, 2021 - Comments: 0

Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like nothing any of us have experienced before. QP Technologies has been fortunate to weather the pandemic well – less than 0.05% of our staff has tested positive, w... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Arm announced its Armv9 architecture, which is designed for secure, pervasive computing that can run in more types of AI systems. Because most data will be touching an Arm-based chip in the near future — whether on the edge, IoT, or data center — Arm enhanced the security, in addition to improving performance and AI/ML capabil... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Reshoring Vital To The Future Of Chipmaking
By Ken Molitor - 18 Mar, 2021 - Comments: 0

Repatriating offshore manufacturing efforts to the United States – i.e., “reshoring” – is not a new concept. The Reshoring Initiative was founded in 2010, and the Reshoring Institute, founded in 2014, conducts annual surveys of global manufacturers regarding their reshoring plans. The institute’s 2019 survey found that, while a growing number of businesses were rethinking their global... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Mar, 2021 - Comments: 0

Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

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