tag: proteanTecs

Geo-Spatial Outlier Detection
By Anne Meixner - 19 Jul, 2021 - Comments: 0

Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

IC Data Hot Potato: Who Owns And Manages It?
By Susan Rambo And Ed Sperling - 06 Jul, 2021 - Comments: 1

Modern inspection, metrology, and test equipment produces a flood of data during the manufacturing and testing of semiconductors. Now the question is what to do with all of that data. Image resolutions in inspection and metrology have been improving for some time to deal with increased density and smaller features, creating a downstream effect that has largely gone unmanaged. Higher resoluti... » read more

Reliability Costs Becoming Harder To Track
By Ed Sperling And Susan Rambo - 08 Jun, 2021 - Comments: 0

Ensuring reliability in chips is becoming more complex and significantly more expensive, shifting left into the design cycle and right into the field. But those costs also are becoming more difficult to define and track, varying greatly from one design to the next based upon process node, package technology, market segment, and which fab or OSAT is used. As the number of options increases fo... » read more

In-field, In-Mission Reliability Monitoring Based On Deep Data
By proteanTecs - 08 Jun, 2021 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

Monitoring Performance From Inside A Chip
By Ed Sperling - 01 Jun, 2021 - Comments: 0

Deep data, which is generated inside the chip rather than externally, is becoming more critical at each new process node and in advanced packages. Uzi Baruch, chief strategy officer at proteanTecs, talks with Semiconductor Engineering about using that data to identify potential problems before they result in failures in the field, and why it's essential to monitor these devices throughout their... » read more

Chip Monitoring And Test Collaborate
By Bryon Moyer - 11 May, 2021 - Comments: 0

As on-chip monitoring becomes more prevalent in complex advanced-node ICs, it’s easy to question whether or not it conflicts with conventional silicon testing. It might even supplant such testing in the future. Or alternatively, they could interact, with each supporting the other. “On-chip monitors provide fine-grained observability into effects and issues that are otherwise difficult or... » read more

Testing Analog Circuits Becoming More Difficult
By Susan Rambo - 11 May, 2021 - Comments: 1

Foundries and packaging houses are wrestling how to control heat in the testing phase, particularly as devices continue to shrink and as thermally sensitive analog circuits are added into SoCs and advanced packages to support everything from RF to AI. The overriding problem is that heat can damage chips or devices under test. That's certainly true for digital chips developed at advanced node... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Apr, 2021 - Comments: 0

Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration hasn’t changed any of the previous policies and is doubling down on those efforts. The Department of Commerce’s Bureau of Industry and Security (BIS) this week added seven Chinese supercomput... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 09 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back LG Electronics says it is closing its mobile business unit to focus on growth areas such as electric vehicle components, connected devices, smart homes, robotics, artificial intelligence and business-to-business solutions, as well as platforms and services. The company will continue to update some premium phones after it leaves th... » read more

AI In Inspection, Metrology, And Test
By Susan Rambo And Ed Sperling - 06 Apr, 2021 - Comments: 0

AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy