tag: proteanTecs

Hunting For Open Defects In Advanced Packages
By Anne Meixner - 17 Mar, 2021 - Comments: 5

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for these chips, the greater the effort and the cost. Latent open defects continue to be the bane of test, quality, and reliability engineering. Open defects in packages occur at the chip-to-substra... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Mar, 2021 - Comments: 0

Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Mar, 2021 - Comments: 0

Automotive/Mobility General Motors is working on a next version of Ultium battery chemistry and announced a joint development agreement with Singapore-based SolidEnergy Systems, a lithium metal battery startup founded by a graduate of MIT. The companies plan to open a Woburn, Massachusetts prototype production line by 2023. GM’s is attempting to lower the cost of its proprietary battery tech... » read more

Using 5nm Chips And Advanced Packages In Cars
By Ed Sperling - 10 Mar, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss the impact of advanced node chips and advanced packaging on automotive reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of... » read more

Preventing Chips From Burning Up During Test
By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Mar, 2021 - Comments: 0

Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Mar, 2021 - Comments: 0

Automotive/Mobility Chip-telemetry company proteanTecs has joined TSMC’s IP Alliance Program, which puts proteanTecs’ Universal Chip Telemetry (UCT) IP into TSMC’s catalog of production-proven IP. UCT is a monitoring system designed directly into chips to pull measurements from inside the chip throughout its lifecycle, including after placement in systems in the field. Monitoring the hea... » read more

Predicting And Avoiding Failures In Automotive Chips
By Ed Sperling - 02 Mar, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Automotive Test Moves In-System
By Bryon Moyer - 09 Feb, 2021 - Comments: 1

With the electrification of automobiles, it’s not enough to test the new electronics thoroughly at the end of the manufacturing process. Safety standards now require that tests be performed live, in the field, with contingency plans should a test fail. “We see clear demand from the automotive semiconductor supply chain for design functionality specifically aimed at in-system monitoring,�... » read more

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