tag: proteanTecs

Automakers Changing Tactics On Reliability
By Susan Rambo - 14 Jan, 2020 - Comments: 0

Automakers are beginning to rethink how to ensure automotive electronics will remain reliable over their projected lifetimes, focusing their efforts on redundancy, more data-centric architectures and continued testing throughout the life of a vehicle. It is still too early to really know how automotive chips actually will perform over the next 15 to 20 years, especially AI logic developed at... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Dec, 2019 - Comments: 0

Fab tools and materials In a blog, David Haynes, managing director of strategic marketing at Lam Research, talks about the IoT and automotive chip markets, which are fabricated at a wide range of technology nodes. Hoya recently made an unsolicited $1.4 billion bid to acquire NuFlare, a supplier of e-beam mask writers and other equipment. Click here for more information. Hoya makes several p... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Dec, 2019 - Comments: 0

Chipmakers and OEMs TrendForce has released its projected foundry rankings for the fourth quarter of 2019. TSMC remains in first place, followed by Samsung, GlobalFoundries and UMC, according to the firm. “TrendForce projects the foundry industry’s 4Q19 revenue performance to exceed previous expectations,” according to the firm. “Nonetheless, the ongoing U.S-China trade war and uncerta... » read more

Gaps Emerge In Test And Analytics
By Ed Sperling - 10 Dec, 2019 - Comments: 0

Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

Improving Reliability Monitoring Of High-Bandwidth Memory
By Eyal Fayneh - 10 Dec, 2019 - Comments: 0

As the quest for increased bandwidth and speed continues, multi-die technologies with advanced memory architectures are introduced. As the complexity of these heterogenous packaging continues to develop, new reliability challenges arise. A new approach to HBM subsystem monitoring and repair provides advanced in-field reliability assurance. By applying analytics to data created by on-chip Age... » read more

Different Ways To Improve Chip Reliability
By Ed Sperling - 12 Nov, 2019 - Comments: 1

A push toward greater reliability in safety- and mission-critical applications is prompting some innovative approaches in semiconductor design, manufacturing, and post-production analysis of chip behavior. While quality over time has come under intensive scrutiny in automotive, where German carmakers require chips to last 18 years with zero defects, it isn't the only market demanding extende... » read more

Reducing Costly Flaws In Heterogeneous Designs
By Ed Sperling - 08 Oct, 2019 - Comments: 0

The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

From Womb To Tomb: A Lifetime Of Chip Data In A Common Language
By Noam Brousard - 08 Oct, 2019 - Comments: 0

Every integrated circuit (IC) has a lifetime of stories to tell. From design through the end of a chip’s life, it can let us know what’s happening all along the way, providing we give it a voice and the language to do so. But until we can gain access to this data, the lives of these ICs remain secret. In-chip monitoring opens up those secrets. It helps to optimize performance, and it is esp... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Degradation Monitoring – From Vision to Reality
By Evelyn Landman - 06 Aug, 2019 - Comments: 0

Reliability physics has historically focused on models for time-to-failure, but that approach is reaching its limit. Those models generally were developed using data gathered from very simple test structures that could be stressed to failure. Today, with electronics playing a such a critical role in our everyday life, failures are no longer an option. The underlying ICs being implemented call f... » read more

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