Examining The Impact Of Chip Power Reduction On Data Center Economics


In the rapidly evolving landscape of data centers, optimizing energy consumption has become a critical focus. In this blog post, we'll delve into the intricacies of power consumption, exploring the economics of three key components: CPUs, GPUs, and AI accelerators, and how the implementation of proteanTecs power reduction solution transforms both power efficiency and computational capabilities... » read more

Application-Specific Power Performance Optimizer Based On Chip Telemetry


As datacenter power consumption continues to pose cooling and cost challenges, and battery driven devices are expected to last longer between charges, the search for advanced power management mechanisms continues. A modern design must balance between maximizing performance, consuming the least amount of power, and guaranteeing no failures in field. The latter requires safety margins which tr... » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Adaptive Test Ramps For Data Intelligence Era


Widely available and nearly unlimited compute resources, coupled with the availability of sophisticated algorithms, are opening the door to adaptive testing. But the speed at which this testing approach is adopted will continue to vary due to persistent concerns about data sharing and the potential for IP theft and data leakage. Adaptive testing is all about making timely changes to a test p... » read more

Hidden Costs And Tradeoffs In IC Quality


Balancing reliability against cost is becoming more difficult for semiconductor test, as chip complexity increases and devices become more domain-specific. Tests need to be efficient and effective without breaking the bank, while also ensuring chips are of sufficient quality for their specific application. The problem is that every new IC device adds its own set of challenges, from smaller f... » read more

From Data To Safety On-The-Road Hardware Health Monitoring


The automotive industry is currently experiencing a transformation driven by electrification, connectivity, and autonomous driving. Vehicles require extensive computational capabilities and generate massive amounts of data. Future cars will embrace new architectures, becoming software-defined "computers on wheels" capable of hosting advanced applications, machine learning algorithms, and contin... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Reducing Power In Data Centers


The rollout of generative AI, coupled with more data in general, is requiring data centers to run servers harder and longer. That, in turn, is generating more heat and accelerating aging, and to ensure these systems continue working over their projected lifetimes, chipmakers are building extra margin into chips. That increases the amount of energy required to run and cool them, and it can short... » read more

Plugging Gaps In The IC Supply Chain


Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

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