tag: proteanTecs

Need To Share Data Widens In IC Manufacturing
By Ed Sperling - 31 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

Using Data More Effectively In Chip Manufacturing
By Ed Sperling - 23 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss smart manufacturing and how tools and AI can enable it for semiconductors, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice president of corporate ma... » read more

Predictive And Prescriptive Maintenance In The Context Of Automotive Functional Safety
By proteanTecs - 08 Aug, 2023 - Comments: 0

The ever-changing landscape of advanced SOCs reshape traditional approaches of automotive functional safety (FuSa). Electrification (EV), connectivity, driver-assistance (ADAS), and software-defined vehicles (SDV) have ushered in the era of mega-functionality and scale. This paper discusses the paradigm shifts and required methodologies to navigate the surge of innovation and ensure the utmost ... » read more

Battling Over Shrinking Physical Margin In Chips
By Ed Sperling - 31 Jul, 2023 - Comments: 0

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

DAC/SEMICON West 2023 Roundup
By The SE Staff - 17 Jul, 2023 - Comments: 0

The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year's SEMICON West, both in presentations and one-on-one discussions. Challenges range from sharing data securely across a highly integrated supply chain, particularly in light of heterogeneous integration, security concerns, and the increased use of AI, as well as concerns about the robus... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 14 Jul, 2023 - Comments: 0

SEMICON West returned in force this week, with a focus on AI and deep learning  in semiconductor manufacturing, security, heterogenous ICs, and the march toward a $1 trillion chip market. Lam Research President and CEO, Tim Archer, opened with the keynote presentation. Fig. 1: SEMICON West panel: AI’s influence on growth, China-U.S. trade war, and the importance of climate policy were... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips
By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

The Future Of Chiplet Reliability
By Nir Sever - 11 Jul, 2023 - Comments: 0

Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with dies in different process nodes while improving yield, which decreases exponentially with size. However, 2.5D/3D designs introduce a fair share of new challenges, one of the most significant be... » read more

Pinpointing Timing Delays in Complex SoCs
By Anne Meixner - 11 Jul, 2023 - Comments: 0

Telemetry circuits are becoming a necessity in complex heterogeneous chips and packages to show how these devices are behaving post-production, but fusing together relevant data to identify the sources of problems adds its own set of challenges. In the past, engineering teams could build margin into chips to offset any type of variation. But at advanced nodes and in advanced packages, tolera... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 07 Jul, 2023 - Comments: 0

China retaliated against a U.S. embargo on advanced semiconductor equipment exports by restricting exports of gallium and germanium. Both metals are widely used in semiconductors and electric vehicles. Despite export controls for advanced chips and equipment imposed on Chinese foundries by the U.S. and its allies, TrendForce predicts China's 300mm market share likely will increase from 24% ... » read more

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