Research Bits: Apr. 14


Authentication for edge devices Researchers from the University of Hong Kong, Tsinghua University, and the Southern University of Science and Technology designed a privacy-preserving system for edge devices that combines physically unclonable functions and compute-in-memory. The Co-Located Authentication and Processing (CLAP) system integrates authentication and processing functions within ... » read more

Untrusted Analog Components Add Risks For Critical Infrastructure


Key Takeaways New certificate-based solutions are necessary within fabs and packaging houses to deliver trusted semiconductors. Physical IDs bind the device to the certificate, but it needs to be immutable and unclonable. Extrinsic IDs are required for analog, mixed-signal, sensor ICs as well as discrete components. Rising concern over the source and destination of chips, an... » read more

Leveraging NEMS To Address Critical Hardware Security Challenges In Advanced Packaging (U. of Florida)


A new technical paper titled "Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging" was published by researchers at University of Florida. Abstract "As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated attacks such as tampering, counterfeit... » read more

The Competitive Advantage Of SRAM PUF Technology


By Vincent van der Leest and Geert-Jan Schrijen In the article from 2024, "SRAM PUF: The Secure Silicon Fingerprint", we explored the fundamentals of SRAM-based Physical Unclonable Functions (PUFs) and their role as a secure, cost-effective, and scalable solution for cryptographic (root) key generation and storage. SRAM PUF technology leverages the unique physical properties of silicon to c... » read more

New Approaches To Limit Cyberattacks On Hardware


The number and value of cyberattacks on semiconductors is rising, but new approaches to designing and packaging chips could put a significant dent in those figures. Semiconductor-related cybersecurity attacks have multiplied more than six times since 2022, according to a report by cyber intelligence firm CloudSEK. These attacks have cost the semiconductor industry an estimated $1.05 billion ... » read more

Infusing Trust Into The Supply Chain


An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

V-NAND PUFs (Seoul National University, SK hynix)


A new technical paper titled "Concealable physical unclonable functions using vertical NAND flash memory" was published by researchers at Seoul National University and SK hynix. The paper proposes "a concealable PUF using V-NAND flash memory by generating PUF data through weak Gate-Induced-Drain-Leakage (GIDL) erase." Find the technical paper here. June 2025. Park, SH., Koo, RH., Yang,... » read more

Addressing Quantum Computing Threats With SRAM PUFs


You’ve probably been hearing a lot lately about the quantum-computing threat to cryptography. If so, you probably also have a lot of questions about what this “quantum threat” is and how it will impact your cryptographic solutions. Let’s take a look at some of the most common questions about quantum computing and its impact on cryptography. What is a quantum computer? A quantum comput... » read more

SRAM Security Concerns Grow


SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts from planar SoCs to heterogeneous systems in package, such as those used in AI or edge processing, where chiplets frequently have their own memory hi... » read more

Plugging Gaps In The IC Supply Chain


Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

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