Research Bits: May 3


Fingerprinting quantum noise Scientists from the University of Chicago and Purdue University propose a different method of understanding the effect of noise in quantum computers. Instead of trying to measure it directly, they created a 'fingerprint' of how the noise impacts a program run on the computer. “We wondered if there was a way to work with the noise, instead of against it,” sai... » read more

Research Bits: April 13


Washable battery Researchers from the University of British Columbia developed a washable, flexible, and stretchable battery. “Wearable electronics are a big market and stretchable batteries are essential to their development,” said Dr. Ngoc Tan Nguyen, a postdoctoral fellow at UBC’s faculty of applied science. “However, up until now, stretchable batteries have not been washable. Th... » read more

Research Bits: March 29


Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

Technical Paper Round-Up: March 29


Improving batteries, ultra low-power photonic edge computing, SLAM, Tellurium for 2D semiconductors, and reservoir computing top the past week's technical papers. The focus on energy is critical as the edge buildout continues and more devices are connected to a battery, while research into new architectures and materials that will continue scaling and improve performance per watt continue at th... » read more

Bell state analyzer for spectrally distinct photons


Abstract "We demonstrate a Bell state analyzer that operates directly on frequency mismatch. Based on electro-optic modulators and Fourier-transform pulse shapers, our quantum frequency processor design implements interleaved Hadamard gates in discrete frequency modes. Experimental tests on entangled-photon inputs reveal fidelities of ∼98% for discriminating between the |Ψ+⟩ and |Ψ−⟩... » read more

The resurrection of tellurium as an elemental two-dimensional semiconductor


Abstract "The graphene boom has triggered a widespread search for novel elemental van der Waals materials thanks to their simplicity for theoretical modeling and easy access for material growth. Group VI element tellurium is an unintentionally p-type doped narrow bandgap semiconductor featuring a one-dimensional chiral atomic structure which holds great promise for next-generation electronic, ... » read more

Research Bits: March 15


Interferometer on chip Researchers at the University of Rochester developed an optical interferometer on a 2mm by 2mm integrated photonic chip that is capable of amplifying interferometric signals without a corresponding increase in extraneous noise. Interferometers merge two or more sources of light to create interference patterns that provide information able what they illuminate. “If y... » read more

Power/Performance Bits: Feb. 15


3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Power/Performance Bits: Feb. 7


Stopping interference in integrated photonics Researchers at EPFL and Purdue University combined integrated photonics and MEMS to develop an electrically driven optical isolator-on-a-chip that transmits light in only one direction. Optical isolators are useful to prevent reflected light from other components compromising or interfering with an on-chip laser’s performance. They are often c... » read more

Manufacturing Bits: Feb. 1


Fab equipment cybersecurity In a major step to help provide security in the semiconductor manufacturing supply chain, SEMI has published the first cybersecurity specifications and standards for fab equipment. For some time, the semiconductor industry has been developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP... » read more

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