Chip Industry Week In Review

By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Visa Shakeup On Tap To Help Solve Worker Shortage

By Liz Allan - 04 Jan, 2024 - Comments: 5

Governments around the world are racing to train workers to design, manufacture, and package chips, but they are facing a talent shortfall that is expected to continue despite their best efforts — particularly for those engineers capable of designing and producing the most advanced chips. The Semiconductor Industry Association (SIA) predicts a U.S. chip worker shortfall of 67,000 by 2030, ... » read more

Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Research Bits: Jan. 2

By Jesse Allen - 02 Jan, 2024 - Comments: 0

Synaptic transistor Researchers from Northwestern University, Boston College, and MIT developed a synaptic transistor that simultaneously processes and stores information similar to the human brain. The team said the transistor goes beyond simple machine learning tasks to categorize data and is capable of performing associative learning. The new device is stable at room temperatures. It als... » read more

Research Bits: December 5

By Jesse Allen - 05 Dec, 2023 - Comments: 0

Neuromorphic nanowires Researchers from UCLA and University of Sydney built an experimental computing system physically modeled after the biological brain. The device is composed of a tangled-up network of wires containing silver and selenium that were allowed to self-organize into a network of entangled nanowires on top of an array of 16 electrodes. The nanowire network physically reconfigure... » read more

Technical Paper Roundup: November 28

By Linda Christensen - 28 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=169 /] More Reading Technical Paper Library home » read more

Technical Paper Roundup: November 21

By Liz Allan - 21 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

New Polymer-Based Semiconductor: Harnessing The Power of Chirality

By Technical Paper Link - 20 Nov, 2023 - Comments: 0

A technical paper titled “Subtle Molecular Changes Largely Modulate Chiral Helical Assemblies of Achiral Conjugated Polymers by Tuning Solution-State Aggregation” was published by researchers at University of Illinois Urbana-Champaign and Purdue University. Abstract: "Understanding the solution-state aggregate structure and the consequent hierarchical assembly of conjugated polymers is cr... » read more

Using Atomic Vacancies In Silicon Carbide To Measure The Stability And Quality Of Acoustic Resonators

By Technical Paper Link - 14 Nov, 2023 - Comments: 0

A technical paper titled “Spin-acoustic control of silicon vacancies in 4H silicon carbide” was published by researchers at Harvard University and Purdue University. Abstract: "Bulk acoustic resonators can be fabricated on the same substrate as other components and can operate at various frequencies with high quality factors. Mechanical dynamic metrology of these devices is challenging as... » read more

Chip Industry’s Technical Paper Roundup: October 31

By Liz Allan - 31 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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