Meeting Cost And Technology Requirements Using MLF/QFN

By Amkor - 14 Dec, 2022 - Comments: 0

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a 111B-unit market for 2022 across five markets: automotive, consumer, industrial, networking, and communications (Figure 1). The package solution requirements across these markets vary but, the fund... » read more

Advanced Packaging Moves To Cars

By Ann Mutschler - 07 Aug, 2017 - Comments: 0

By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slow�... » read more

Wirebond Technology Rolls On

By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

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Meeting Cost And Technology Requirements Using MLF/QFN

Advanced Packaging Moves To Cars

Wirebond Technology Rolls On

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