Building Complex Chips That Last Longer


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Data Tsunami Pushes Boundaries Of IC Interconnects


Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a package. In the past, this was largely handled by the on-chip interconnects, which often were a secondary consideration in the design. But with the rising volumes of data in markets ranging fro... » read more

Week In Review: Manufacturing, Test


Packaging and test Advantest and PDF Solutions have launched their first jointly developed offering since forming a partnership in 2020. The new product is called the Advantest Cloud Solutions Dynamic Parametric Test (ACS DPT) solution. It integrates PDF Solutions’ Exensio portfolio of data analytics with Advantest’s V93000 Parametric Test System. The ACS DPT solution is designed to op... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Intel’s Mobileye and Sixt SE said they are collaborating on an autonomous ride-hailing services in Munich in 2022. Mobileye will own the robotaxi fleet. Mobileye also recently unveiled its electric autonomous vehicle (AV), which it will use in ridehailing in Munich and Tel Aviv.. To increase the supply of automotive chips, Intel said it will build new chip manufacturing facilit... » read more

Why TinyML Is Such A Big Deal


While machine-learning (ML) development activity most visibly focuses on high-power solutions in the cloud or medium-powered solutions at the edge, there is another collection of activity aimed at implementing machine learning on severely resource-constrained systems. Known as TinyML, it’s both a concept and an organization — and it has acquired significant momentum over the last year or... » read more

Week In Review: Manufacturing, Test


Chipmakers Taiwan’s Foxconn continues to expand its efforts in the semiconductor business. Foxconn has acquired a 6-inch wafer fab and the equipment from Taiwan’s Macronix for NT$2.52 billion (US$90.76 million). With the fab, Foxconn plans to enter the wideband gap semiconductor market, namely silicon carbide (SiC). SiC devices are used in electric vehicles, a market that Foxconn is making... » read more

Week In Review: Design, Low Power


Marvell will acquire Innovium, a provider of Ethernet data center switches, in an all-stock transaction valued at $1.1 billion. Innovium's switching architecture is optimized for ultra-low latency, optimized power, high performance, and telemetry in cloud applications and will join Marvell's portfolio of data center products to provide "architectural choice and flexibility to meet a diverse set... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The New York Auto Show has been canceled due to concerns over the COVID-19 Delta variant. The show, which usually occurs in April, was scheduled for August 20 through 29th. Semiconductor company Qualcomm has offered to acquire Veoneer, an ADAS company, for $37 per share in cash. Automotive Tier 1 Magna International already has a definitive merger agreement to acquire Veoneer, wh... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Xilinx is investing an undisclosed amount in fabless semiconductor startup Kameleon Security, which is working on a cyber protection chip for servers, data centers, and cloud computing. The proactive Security Processing Unit (ProSPU) already secures the boot and has a root of trust (RoT). The chip will be demonstrated at the Open Compute Project (OCP) Global Summit, which is planned f... » read more

Chip Shortages Grow For Mature Nodes


The current wave of chip shortages is expected to last for the foreseeable future, particularly for a growing list of critical devices produced in mature process nodes. Chips manufactured at mature nodes typically fall under the radar, but they are used in nearly every electronic device, including appliances, cars, computers, displays, industrial equipment, smartphones, and TVs. Many of thes... » read more

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