tag: radar

FPGAs Drive Deeper Into Cars
By Ann Mutschler - 09 Jul, 2018 - Comments: 3

FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

Disruption Is Here In Automotive And Ground Transportation: Are You Ready?
By Ansys - 13 Jun, 2018 - Comments: 0

The automotive and ground transportation industry is being disrupted with the rise of shared, connected, self-driving, electrified vehicles. For those who can innovate fast, it is a once-in-a-century opportunity to leapfrog the competition and win the race to dominate the new mobility industry. Simulation is the key enabler. Are you ready for innovation through simulation? Engineering simula... » read more

Auto Industry Driving Faster
By Mark Granger - 23 Apr, 2018 - Comments: 0

Automotive electronics used to be a lumbering, trailing-edge business. Not anymore. Today, powerful semiconductor technologies are driving the development of automotive features that once might have been seen as science fiction, such as advanced driver-assistance systems (ADAS) which are paving the way to self-driving cars. Overall, the market for semiconductors in automotive applications is... » read more

Processing Moves To The Edge
By Kevin Fogarty - 12 Apr, 2018 - Comments: 0

Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

FD-SOI Adoption Expands
By Ed Sperling - 21 Feb, 2018 - Comments: 2

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs. For years, [getkc id="220" kc_name="FD-SOI"] has been viewed as an either/or solution targeted at the same markets as bulk [gettech id="31093" c... » read more

Driving By Ethernet
By Ann Mutschler - 01 Feb, 2018 - Comments: 0

The race to add more sophisticated and safety-critical electronics into cars is forcing carmakers to revisit the communications systems within increasingly electrified and connected vehicles. Until very recently, communication between components within a vehicle was simplistic, and communication between vehicles was non-existent. All of that is changing quickly. Rapid and secure communicatio... » read more

Automotive Startup Activity Swelling
By Ann Mutschler - 04 Jan, 2018 - Comments: 0

According to AngelList, there are at least 6,600 automotive startups, with a $4.6 million average valuation. 475 of those are electric vehicle startups with a $5 million average valuation. Indeed, the electrification of vehicles and move towards autonomous driving is having a huge impact, the likes of which the automotive industry has never seen. This is causing the car manufacturers and Tie... » read more

Fan-Outs vs. TSVs
By Jeff Dorsch - 13 Dec, 2017 - Comments: 0

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Reliability Of Embedded Wafer-Level BGA For Automotive Radar Applications
By STATS ChipPAC - 11 Dec, 2017 - Comments: 0

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

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