Video Compression Enables Cutting-Edge Displays


Display technology has advanced in leaps and bounds. We can now create professional-quality video content on our mobiles, and our cars often have more displays than our living room. In recent years, electronics manufacturers have been using increasingly sophisticated display feature sets as a way of differentiating their products in the highly competitive consumer electronics market. Each new g... » read more

DRAM Thermal Issues Reach Crisis Point


Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

Keeping IC Packages Cool


Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

The Methods Of Memory Encryption To Protect Data In Use


In my blog “The Importance of Memory Encryption for Protecting Data in Use,” I discussed the growing industry consensus on the imperative of incorporating memory encryption in computing architectures. In part two of this series, I’ll explore the cipher algorithms and modes that can be used to protect data stored in and accessed from memory, or in other words, used to protect data in use. ... » read more

Chip Substitutions Raising Security Concerns


Substituting chips is becoming more common in the electronics industry as shortages drag on, allowing systems vendors to continue selling everything from cars to manufacturing equipment and printer cartridges without waiting for a commoditized part. But substitutions aren't always an even swap, and they increase security risks in ways that may take years to show up or fully understand. So fa... » read more

Automotive Bandwidth Issues Grow As Data Skyrockets


Bandwidth requirements for future vehicles are set to explode as the amount of data moving within vehicles, between vehicles, and between vehicles and infrastructure, continues to grow rapidly. That data will be necessary for a variety of functions, some of which are here today and many of which are still in development. On the safety side, that includes everything from early warning systems... » read more

Navigating The Intersection Of Safety And Security


Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Week In Review: Design, Low Power


EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Blog Review: May 25


Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

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