tag: Rambus

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

The Methods Of Memory Encryption To Protect Data In Use
By Rocky Zhang - 06 Jun, 2022 - Comments: 0

In my blog “The Importance of Memory Encryption for Protecting Data in Use,” I discussed the growing industry consensus on the imperative of incorporating memory encryption in computing architectures. In part two of this series, I’ll explore the cipher algorithms and modes that can be used to protect data stored in and accessed from memory, or in other words, used to protect data in use. ... » read more

Chip Substitutions Raising Security Concerns
By Ed Sperling - 02 Jun, 2022 - Comments: 0

Substituting chips is becoming more common in the electronics industry as shortages drag on, allowing systems vendors to continue selling everything from cars to manufacturing equipment and printer cartridges without waiting for a commoditized part. But substitutions aren't always an even swap, and they increase security risks in ways that may take years to show up or fully understand. So fa... » read more

Automotive Bandwidth Issues Grow As Data Skyrockets
By Ann Mutschler - 02 Jun, 2022 - Comments: 0

Bandwidth requirements for future vehicles are set to explode as the amount of data moving within vehicles, between vehicles, and between vehicles and infrastructure, continues to grow rapidly. That data will be necessary for a variety of functions, some of which are here today and many of which are still in development. On the safety side, that includes everything from early warning systems... » read more

Navigating The Intersection Of Safety And Security
By Rambus - 01 Jun, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Blog Review: May 25
By Jesse Allen - 25 May, 2022 - Comments: 0

Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

DRAM Choices Becoming Central Design Considerations
By Ann Mutschler - 12 May, 2022 - Comments: 0

Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory to a critical design element that can affect system performance, power, and cost. These are increasingly important issues to sort through with a number of tradeoffs, but the general consensus is that to reach the higher levels of performance ... » read more

Improving PPA With AI
By John Koon - 12 May, 2022 - Comments: 0

AI/ML/DL is starting to show up in EDA tools for a variety of steps in the semiconductor design flow, many of them aimed at improving performance, reducing power, and speeding time to market by catching errors that humans might overlook. It's unlikely that complex SoCs, or heterogeneous integration in advanced packages, ever will be perfect at first silicon. Still, the number of common error... » read more

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