Chip Industry Week In Review

By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

GDDR7 Memory Supercharges AI Inference

By Tim Messegee - 17 Oct, 2024 - Comments: 0

GDDR7 is the state-of-the-art graphics memory solution with a performance roadmap of up to 48 Gigatransfers per second (GT/s) and memory throughput of 192 GB/s per GDDR7 memory device. The next generation of GPUs and accelerators for AI inference will use GDDR7 memory to provide the memory bandwidth needed for these demanding workloads. AI is two applications: training and inference. With tr... » read more

Mass Customization For AI Inference

By Ann Mutschler - 17 Oct, 2024 - Comments: 0

Rising complexity in AI models and an explosion in the number and variety of networks is leaving chipmakers torn between fixed-function acceleration and more programmable accelerators, and creating some novel approaches that include some of both. By all accounts, a general-purpose approach to AI processing is not meeting the grade. General-purpose processors are exactly that. They're not des... » read more

Confidential Computing: A Key To Secure Cloud And Edge Environments

By Raj Uppala - 10 Oct, 2024 - Comments: 0

Historically, data security was primarily focused on safeguarding data residing within systems controlled by the users themselves, such as on-premise storage and server infrastructure. In such a siloed environment, information stored on the storage media, Data-at-Rest, was encrypted to ensure security. Data-in-Motion (aka Data-in-Transit) was safeguarded by encrypting it before transmitting it ... » read more

Managing Legacy In Automotive

By Ann Mutschler - 10 Oct, 2024 - Comments: 0

Experts At The Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing levels of autonomy, electrification, software defined vehicle concepts, just to name a few. Semiconductor Engineering sat down to discuss these and other related issues with Wayne Lyons, senior dir... » read more

CXL Thriving As Memory Link

By Karen Heyman - 16 Sep, 2024 - Comments: 0

CXL is emerging from a jumble of interconnect standards as a predictable way to connect memory to various processing elements, as well as to share memory resources within a data center. Compute Express Link is built on a PCI Express foundation and supported by nearly all the major chip companies. It is used to link CPUs, GPUs, FPGAs, and other purpose-built accelerators using serial communic... » read more

Chip Industry Week In Review

By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

HBM4 Feeds Generative AI’s Hunger For More Memory Bandwidth

By Nidish Kamath - 12 Sep, 2024 - Comments: 0

Generative AI (Gen AI), built on the exponential growth of Large Language Models (LLMs) and their kin, is one of today’s biggest drivers of computing technology. Leading-edge LLMs now exceed a trillion parameters and offer multimodal capabilities so they can take a broad range of inputs, whether they’re in the form of text, speech, images, video, code, and more, and generate an equally broa... » read more

Higher Density, More Data Create New Bottlenecks In AI Chips

By Adam Kovac - 12 Sep, 2024 - Comments: 0

Data movement is becoming a bigger problem at advanced nodes and in advanced packaging due to denser circuitry, more physical effects that can affect the integrity of signals or the devices themselves, and a significant increase in data from AI and machine learning. Just shrinking features in a design is no longer sufficient, given the scaling mismatch between SRAM-based L1 cache and digital... » read more

Chip Industry Week In Review

By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

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Chip Industry Week In Review

GDDR7 Memory Supercharges AI Inference

Mass Customization For AI Inference

Confidential Computing: A Key To Secure Cloud And Edge Environments

Managing Legacy In Automotive

CXL Thriving As Memory Link

Chip Industry Week In Review

HBM4 Feeds Generative AI’s Hunger For More Memory Bandwidth

Higher Density, More Data Create New Bottlenecks In AI Chips

Chip Industry Week In Review

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