Innovative Cybersecurity Solutions Accelerate TTM For The Software-Defined Vehicle

By Adiel Bahrouch - 04 Apr, 2024 - Comments: 0

The automotive industry is undergoing a transformative shift towards the software-defined vehicle (SDV), signaling a new era that prioritizes customer-centric mobility and presents new, data-based revenue opportunities across the automotive value chain and ecosystem. However, this transition also presents many challenges, from managing increasingly complex hardware (HW) and software (SW) design... » read more

HBM3E Memory: Break Through to Greater Bandwidth

By Rambus - 03 Apr, 2024 - Comments: 0

Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI training. HBM3 is the third major generation of the HBM standard, with HBM3E offering an extended data rate and the same feature set. The Rambus HBM3E/3 Controller provides industry-leading performance to 9.6 Gb/s, enabling a memory throughput of over 1.23 TB/s for training reco... » read more

Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

The Implications Of AI Everywhere: From Data Center To Edge

By Emma-Jane Crozier - 14 Mar, 2024 - Comments: 0

Generative AI has upped the ante on the transformative force of AI, driving profound implications across all aspects of our everyday lives. Over the past year, we have seen AI capabilities placed firmly in the hands of consumers. The recent news and product announcements emerging from MWC 2024 highlighted what we can expect to see from the next wave of generative AI applications. AI will be eve... » read more

The Rising Price Of Power In Chips

By Ed Sperling - 14 Mar, 2024 - Comments: 0

Power is everything when it comes to processing and storing data, and much of it isn't good. Power-related issues, particularly heat, dominate chip and system designs today, and those issues are widening and multiplying. Transistor density has reached a point where these tiny digital switches are generating more heat than can be removed through traditional means. That may sound manageable e... » read more

Safeguarding IoT Devices With SESIP And PSA Certified Root Of Trust IP

By Bart Stevens - 11 Mar, 2024 - Comments: 0

IoT is everywhere. By the end of 2024, it’s forecasted that there will be a staggering 207 billion IoT devices in the world, that’s 25 each for every human being on Earth. The connectivity of IoT devices brings great value for consumers and businesses alike, but with great connectivity comes greater vulnerability to a wide variety of malicious attacks from cyber criminals. IoT devices ar... » read more

Securing DRAM Against Evolving Rowhammer Threats

By Aharon Etengoff - 07 Mar, 2024 - Comments: 0

Advanced process nodes and higher silicon densities are heightening DRAM's susceptibility to Rowhammer attacks, as reduced cell spacing significantly decreases the hammer count needed for bit flips. Rowhammer exploits DRAM’s single-capacitor-per-bit design to trigger bit flips in adjacent cells through repeated memory row accesses. This vulnerability allows attackers to manipulate data, re... » read more

HBM3E And GDDR6: Memory Solutions For AI

By Rambus - 06 Mar, 2024 - Comments: 0

AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3E and G... » read more

Why Chiplets Are So Critical In Automotive

By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Building Scalable And Efficient Data Centers With CXL

By Lou Ternullo - 15 Feb, 2024 - Comments: 0

The AI boom is giving rise to profound changes in the data center; demanding AI workloads are driving an unprecedented need for low latency, high-bandwidth connectivity and flexible access to more memory and compute power when needed. The Compute Express Link (CXL) interconnect offers new ways for data centers to enhance performance and efficiency between CPUs, accelerators and storage and move... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Rambus