Tackling Reliability In Early IC Design

By Matthew Hogan - 09 Jan, 2025 - Comments: 0

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly difficult. Industry analysts predict a significant increase in demand for semiconductor reliability verification as electromigration and IR drop analysis become critical parts of the overall design ve... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches

By Ann Mutschler - 19 Dec, 2024 - Comments: 1

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Enhancing Power Reliability Through Design-Stage Layout Optimization

By Jeff Wilson - 19 Dec, 2024 - Comments: 0

As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these power, performance and area (PPA) targets is essential for ensuring that IC designs operate effectively at advanced process nodes. One of the main challenges for design and verification engineers is... » read more

RISC-V Profiles Help Conformance

By Brian Bailey - 18 Dec, 2024 - Comments: 0

Experts At The Table: What's needed to be able to trust that a RISC-V implementation will work as expected across multiple designs using standard OSes. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeist... » read more

Why Chips Fail, And What To Do About It

By Ed Sperling - 11 Dec, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips in the context of safety- and mission-critical systems, as well as increasing utilization due to an explosion in AI data, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verificat... » read more

The Vulnerability of Clock Trees to Asymmetric Aging

By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "The Impact of Asymmetric Transistor Aging on Clock Tree Design Considerations" was published by researchers at Israel Institute of Technology and The Hebrew University of Jerusalem. Abstract "Ensuring integrated circuits (ICs) operate reliably throughout their expected service life is more vital than ever, particularly as they become increasingly central to mis... » read more

Extending Chip Lifetime With Safer Voltage Scaling

By Eyal Fayneh - 12 Nov, 2024 - Comments: 0

What if your chips lived 20% longer without compromising performance, and even while reducing power consumption? How would it affect your product’s reliability and cost? What would be the effect on your profitability? With the demand for longer-lasting chips growing across industries, designers and reliability engineers face increasing pressure to ensure their products perform correctly fo... » read more

From Reaction To Prevention In Data Center RAS

By Noam Brousard - 15 Oct, 2024 - Comments: 0

The rise of artificial intelligence (AI), cloud services, and IoT has fueled the rapid expansion of hyperscale data centers. These massive facilities house thousands of servers, all working to support an increasingly digital world. But as the scale of data centers grows, so too does the need for reliable and high-performance semiconductors. Semiconductor failures and inconsistencies can cause s... » read more

New Challenges In IC Reliability

By Ed Sperling - 15 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips, how it is changing, and where the new challenges are, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, high-tech soluti... » read more

Signals In The Noise: Tackling High-Frequency IC Test

By Gregory Haley - 15 Oct, 2024 - Comments: 0

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of millimeter-wave communication in 5G and 6G is pushing manufacturers to develop chips capable of handling frequencies that were once considered out of reach. However, while these technologies promise faster ... » read more

← Older posts

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: reliability

Tackling Reliability In Early IC Design

Strain, Stress In Advanced Packages Drives New Design Approaches

Enhancing Power Reliability Through Design-Stage Layout Optimization

RISC-V Profiles Help Conformance

Why Chips Fail, And What To Do About It

The Vulnerability of Clock Trees to Asymmetric Aging

Extending Chip Lifetime With Safer Voltage Scaling

From Reaction To Prevention In Data Center RAS

New Challenges In IC Reliability

Signals In The Noise: Tackling High-Frequency IC Test

Trending Articles

Is In-Memory Compute Still Alive?

Baby Steps Toward 3D DRAM

Chip Industry Week In Review

Chip Industry Week in Review

What’s Next For Through-Silicon Vias

Knowledge Centers
Entities, people and technologies explored