tag: reliability

NBTI & PBTI of MOSFETs
By Technical Paper Link - 30 May, 2022 - Comments: 0

Technical paper titled "Bias Temperature Instability of MOSFETs: Physical Processes, Models, and Prediction" from researchers at Liverpool John Moores University. Abstract "CMOS technology dominates the semiconductor industry, and the reliability of MOSFETs is a key issue. To optimize chip design, trade-offs between reliability, speed, power consumption, and cost must be carried out. This r... » read more

Hybrid Method For More Reliable Virtual Sensors Within Vehicle Dynamics Control Systems
By Technical Paper Link - 25 May, 2022 - Comments: 0

New technical paper titled "Ensuring the Reliability of Virtual Sensors Based on Artificial Intelligence within Vehicle Dynamics Control Systems" from University of Duisburg-Essen. Abstract "The use of virtual sensors in vehicles represents a cost-effective alternative to the installation of physical hardware. In addition to physical models resulting from theoretical modeling, artificial in... » read more

The Drive Toward Zero Defects
By Prasad Dhond - 19 May, 2022 - Comments: 0

The automotive semiconductor market has doubled twice in the past 20 years. But the next doubling will be even faster. While short-term results may vary, it is certain that auto semis will be much larger 10-20 years from now. Today, a gas-powered car has ~$400 of semiconductor content whereas the Tesla Model 3 with an electric powertrain and Advanced Driver Assist System (ADAS) has >4... » read more

Protecting ICs Against Specific Threats
By Ed Sperling - 18 May, 2022 - Comments: 0

Identifying potential vulnerabilities and attack vectors is a first step in addressing them. Anders Nordstrom, security application engineer at Tortuga Logic, talks with Semiconductor Engineering about the growing risk of remote hardware attacks, what to do when a chip is hacked, and where to find the most common weaknesses for chips. » read more

Hidden Impacts Of Software Updates
By Ed Sperling - 10 May, 2022 - Comments: 0

Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

Where And When End-to-End Analytics Works
By Anne Meixner - 10 May, 2022 - Comments: 0

With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

How AI/ML Improves Fab Operations
By Laura Peters - 10 May, 2022 - Comments: 0

Chip shortages are forcing fabs and OSATs to maximize capacity and assess how much benefit AI and machine learning can provide. This is particularly important in light of the growth projections by market analysts. The chip manufacturing industry is expected to double in size over the next five years, and collective improvements in factories, AI databases, and tools will be essential for doub... » read more

A Case for Transparent Reliability in DRAM Systems
By Technical Paper Link - 29 Apr, 2022 - Comments: 0

New technical paper from ETH Zurich and TU Delft. Abstract "Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigati... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages
By Knowlton Olmstead - 21 Apr, 2022 - Comments: 0

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. Additional... » read more

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