Protecting ICs Against Specific Threats


Identifying potential vulnerabilities and attack vectors is a first step in addressing them. Anders Nordstrom, security application engineer at Tortuga Logic, talks with Semiconductor Engineering about the growing risk of remote hardware attacks, what to do when a chip is hacked, and where to find the most common weaknesses for chips. » read more

Hidden Impacts Of Software Updates


Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

Where And When End-to-End Analytics Works


With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

How AI/ML Improves Fab Operations


Chip shortages are forcing fabs and OSATs to maximize capacity and assess how much benefit AI and machine learning can provide. This is particularly important in light of the growth projections by market analysts. The chip manufacturing industry is expected to double in size over the next five years, and collective improvements in factories, AI databases, and tools will be essential for doub... » read more

A Case for Transparent Reliability in DRAM Systems


New technical paper from ETH Zurich and TU Delft. Abstract "Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigati... » read more

Artificial intelligence deep learning for 3D IC reliability prediction


New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages


As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. Additional... » read more

Big Changes In Materials And Processes For IC Manufacturing


Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

Driving Toward A Sustainable Future


While the automotive industry has been focused on developing innovative electric vehicle (EV) designs for years, there is a new sense of urgency today. Worldwide sales of EVs are increasing quickly1, growing by 46% in 2020 and by 160% in the first half of 2021. Consumer demand is an important factor, but equally important are government mandates. In 2021, the European Union introduced strict... » read more

Silicon Lifecycle Management’s Growing Impact On IC Reliability


Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it's expanding and changing, and where the problems are, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University; a... » read more

← Older posts Newer posts →