How AiP/AoP Technology Helps Enable 5G And More


For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high... » read more

Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package


The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a small form factor with high yield. In addition to formidable SiP capacity and DSMBGA techno... » read more

Empowering RF Front End Cellular Innovations With DSMBGA


With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

5G Communications


This white paper examines the recent advances that the modeling, simulation, and design automation capabilities in Cadence® AWR® software are helping designers develop the antenna and RF front-end components that are making 5G a reality. This primer offers a breadth of application notes on the innovative wizards and synthesis technologies that enable engineers designing 5G communications syst... » read more

Antenna Array Design for ADAS


By Milton Lien and David Vye By implementing radar technology over the 76 to 81 GHz spectrum, advanced driver-assist systems (ADAS) enable smart vehicles with the ability to alert and assist drivers in a variety of functions, from low tire-pressure warning to collision avoidance to self-parking. These automotive radar applications use the millimeter-wave (mmWave) spectrum to exploit more ban... » read more

Design of Phased-Array Antennas for MIMO & Beam-Steering Applications


This white paper explores basic phased-array theory and the design considerations behind next-generation antenna systems. It examines the new capabilities recently added to the NI AWR Design Environment platform for developing the RF front-end hardware supporting these new antenna systems, which must be optimized for performance, reliability, compactness, and cost. Click here to read more. » read more

Integration IP Helps IP Integration


You might not know much about the MIPI Alliance if you aren't designing mobile phones, but you will soon. Other application areas are taking interest in what this group has accomplished. The alliance was founded in 2003 to create standards for hardware and software interfaces in mobile devices. Successful examples include a camera serial interface (CSI) and a display serial interface (DSI), ... » read more

RF Front End Testing With NI PXI


What composes an RF front end in today’s radio devices? If you were to take apart your mobile phone, you would see an assortment of chips with different functions that make wireless communication possible. This white paper focuses on the duplexer, power amplifiers (PAs), and RF transceiver. To read more, click here. » read more

CMOS And SOI Invade RF Front End


By Mark LaPedus The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but arguably the most critical part in a handset—the radio-frequency (RF) front-end. Typically, the RF front-end often comes in a module and includes various key components, such ... » read more