The Importance Of Phase-Coherent RF Signal

By TJ Cartwright - 26 Jan, 2023 - Comments: 0

As the number of higher-throughput applications grows, so does the need for wider bandwidth and network coverage in wireless systems. Given limited spectrum allocation, wireless communication engineers must look for ways to improve spectral efficiency and the signal-to-noise ratio (SNR) of systems. Multiple-input / multiple-output (MIMO) and beamforming can help RF designers achieve diversity, ... » read more

MOVPE Grown (100) Beta-Gallium Oxide Layers for Power Electronics Application

By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "Perspectives on MOVPE-grown (100) β-Ga2O3 thin films and its Al-alloy for power electronics application" was published by researchers at Leibniz-Institut für Kristallzüchtung (IKZ), Germany. "Beta gallium oxide (β-Ga2O3) is a promising ultra-wide bandgap semiconductor with attractive physical properties for next-generation high-power devices, radio frequency ele... » read more

Detailed RF Characterization of Ultra-Thin Indium Oxide Transistors

By Technical Paper Link - 13 Sep, 2022 - Comments: 0

A new technical paper titled "Record RF Performance of Ultra-thin Indium Oxide Transistors with Buried-gate Structure" was published by researchers at Purdue University and won the 2022 Device Research Conference Best Student Paper Award (DRC 2022 held in June). According to this Purdue University news release, "In this work, the radio frequency (RF) performance of indium oxide transistors w... » read more

The Complex Art Of Handling S-Parameters

By Pradeep Thiagarajan - 12 Sep, 2022 - Comments: 1

By Pradeep Thiagarajan and Youssef Abdelkader IC design is transforming at an accelerated pace along with fabrication technology. The need to incorporate more functionality has led to denser dies, multi-die chips, stacked 3D ICs, and advanced packaging. Furthermore, the increasing demand for enhanced connectivity with more and faster access to data continues to drive technology towards highe... » read more

In-Design Thermal Analysis For MMIC And RF PCB Power Applications

By Cadence - 31 Aug, 2022 - Comments: 0

Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and aerospace applications. As a result, RF front-end electronics are exposed to the risk of higher operating temperatures, which degrade RF performance and threaten device reliability. For many device ma... » read more

MicroLEDs Move Toward Commercialization

By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Radar For Automotive: How Far Can A Radar See?

By Marta Martinez Vazquez - 25 Aug, 2022 - Comments: 1

In the previous entries of this blog dedicated to automotive radar, the reason for using radar and the principle of operation of the frequency modulated continuous wave radar were presented. Now, we will focus on the performance of the system, starting with its maximum detection range: how far can we detect an obstacle ahead? We need to have as much foresight as possible, to be able to detect a... » read more

Fan-Out Packaging Gets Competitive

By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Equipment Suppliers Brace For GaN Market Explosion

By Adele Hars - 18 Aug, 2022 - Comments: 0

A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

The Great Migration To 5G Is Underway

By David Vondran - 09 Aug, 2022 - Comments: 0

Every decade brings with it a plethora of technology changes, and the cumulative effects of 50+ years of changes in wireless technologies are noteworthy for how they have changed the way we communicate. The 80’s began the era of personal computing along with 1G rollout The 90’s saw the advent of 64-bit microprocessor architecture in consumer devices coinciding with 2G rollout The... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?