Maximizing Edge Intelligence Requires More Than Computing


By Toshi Nishida, Avik W. Ghosh, Swaminathan Rajaraman, and Mircea Stan Commercial-off-the-shelf (COTS) components have enabled a commodity market for Wi-Fi-connected appliances, consumer products, infrastructure, manufacturing, vehicles, and wearables. However, the vast majority of connected systems today are deployed at the edge of the network, near the end user or end application, opening... » read more

Characterization, Modeling, And Model Parameter Extraction Of 5nm FinFETs


A technical paper titled “A Comprehensive RF Characterization and Modeling Methodology for the 5nm Technology Node FinFETs” was published by researchers at IIT Kanpur, MaxLinear Inc., and University of California Berkeley. Abstract: "This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry stan... » read more

RF Energy Harvesting and Wireless Power Transfer Technologies: Latest Technology & Future Develop Opportunities


A new technical paper titled "RF Energy Harvesting and Wireless Power Transfer for Energy Autonomous Wireless Devices and RFIDs" was published by researchers at Institut Polytechnique de Paris, Universidade de Aveiro, The Hague, McGill University, University of Bordeaux, Polytechnique Montreal, and others. Abstract: "Radio frequency (RF) energy harvesting and wireless power transmission (... » read more

Revising 5G RF Calibration Procedures For RF IC Production Testing


Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

Solving Problems With The IoT


The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

The Importance Of Phase-Coherent RF Signal


As the number of higher-throughput applications grows, so does the need for wider bandwidth and network coverage in wireless systems. Given limited spectrum allocation, wireless communication engineers must look for ways to improve spectral efficiency and the signal-to-noise ratio (SNR) of systems. Multiple-input / multiple-output (MIMO) and beamforming can help RF designers achieve diversity, ... » read more

MOVPE Grown (100) Beta-Gallium Oxide Layers for Power Electronics Application


A technical paper titled "Perspectives on MOVPE-grown (100) β-Ga2O3 thin films and its Al-alloy for power electronics application" was published by researchers at Leibniz-Institut für Kristallzüchtung (IKZ), Germany. "Beta gallium oxide (β-Ga2O3) is a promising ultra-wide bandgap semiconductor with attractive physical properties for next-generation high-power devices, radio frequency ele... » read more

Detailed RF Characterization of Ultra-Thin Indium Oxide Transistors


A new technical paper titled "Record RF Performance of Ultra-thin Indium Oxide Transistors with Buried-gate Structure" was published by researchers at Purdue University and won the 2022 Device Research Conference Best Student Paper Award (DRC 2022 held in June). According to this Purdue University news release, "In this work, the radio frequency (RF) performance of indium oxide transistors w... » read more

The Complex Art Of Handling S-Parameters


By Pradeep Thiagarajan and Youssef Abdelkader IC design is transforming at an accelerated pace along with fabrication technology. The need to incorporate more functionality has led to denser dies, multi-die chips, stacked 3D ICs, and advanced packaging. Furthermore, the increasing demand for enhanced connectivity with more and faster access to data continues to drive technology towards highe... » read more

In-Design Thermal Analysis For MMIC And RF PCB Power Applications


Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and aerospace applications. As a result, RF front-end electronics are exposed to the risk of higher operating temperatures, which degrade RF performance and threaten device reliability. For many device ma... » read more

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