tag: Riken

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Chip Industry Technical Paper Roundup: April 8
By Linda Christensen - 08 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=214 /] Find last week’s technical paper additions here. » read more

Hybrid All-Optical Switching Devices Combining Silicon Nanocavities And 2D Semiconductor Material
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "Hybrid silicon all-optical switching devices integrated with two-dimensional material" was published by researchers at RIKEN, National Institute of Advanced Industrial Science and Technology (AIST), and Keio University. Abstract "We propose and demonstrate hybrid all-optical switching devices that combine silicon nanocavities and two-dimensional semiconduct... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Chip Industry Week In Review
By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Chip Industry’s Technical Paper Roundup: July 5
By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Demonstrating The Utility Of Quantum Computing In A Pre-Fault-Tolerant Era
By Technical Paper Link - 28 Jun, 2023 - Comments: 0

A technical paper titled “Evidence for the utility of quantum computing before fault tolerance” was published by researchers at IBM Quantum, University of California Berkeley, RIKEN, and Lawrence Berkeley National Laboratory. Abstract: "Quantum computing promises to offer substantial speed-ups over its classical counterpart for certain problems. However, the greatest impediment to realizi... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Research Bits: May 31
By Jesse Allen - 31 May, 2022 - Comments: 0

Carbon nanotube transistors Researchers from the National Institute for Materials Science, National University of Science and Technology, Emanuel Institute of Biochemical Physics, Chinese Academy of Sciences, National Institute of Advanced Industrial Science and Technology, University of Tokyo, Tianjin University, and Queensland University of Technology created transistors out of carbon nanotu... » read more

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

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