Achieve 10X Faster CDC Debug Leveraging Machine Learning

By Synopsys - 25 Jan, 2023 - Comments: 0

Over the years, system-on-chip (SoC) design sizes have crossed the billion-gate mark. Higher complexity has been introduced within semiconductor designs to deliver desired functionality. The number of asynchronous clock and reset domains is growing heavily within these complex SoCs, leading to millions of clock domain crossing (CDC) violations at the SoC level. Each of these violations ... » read more

Achieving Faster Closure With Reduced Setup And Debug Using Advanced RTL Static Signoff Platform

By Synopsys - 03 Mar, 2021 - Comments: 0

Many design houses are continually seeking ways to shorten their effective design cycle to address demanding market requirements, gain a formidable technological advantage, and secure leadership in their respective industries. This pressure can cause designers to get extremely overwhelmed by strict timelines. To meet tight project timelines, design teams often resort to identifying industry-lea... » read more

Shift Left Verification With Comprehensive Lint Signoff

By Synopsys - 08 Jul, 2020 - Comments: 0

With soaring complexity and continuously increasing chip sizes, achieving efficient and predictable design closure has become a prominent challenge among designers today. Demand for a faster time to market is forcing designers to find ways to shorten design cycles with accurate, efficient, one-time RTL to silicon. To meet these requirements designers are looking to implement early ”shift left... » read more

ROI Not There Yet For SysML

By Ann Mutschler - 24 Sep, 2015 - Comments: 3

At some point down the road in the realm of system-level design, the Systems Modeling Language (SysML) dialect of the Unified Modeling Language (UML) standard may drive into semiconductor design. So far, however, a return on investment has not been established for its use. SysML is defined as a general-purpose visual modeling language for systems engineering applications, and it supports the... » read more

Do SoCs Need Earthquake Insurance?

By Ann Mutschler - 13 Jun, 2014 - Comments: 1

RTL sign-off is not a new term, but with SoCs that can be comprised of up to 90% IP blocks combined with the complexities that advanced manufacturing process nodes bring, RTL sign-off activities become a process that demands a more comprehensive approach. “There is a fundamental shift going on in chip design in general in that there is a bigger focus on so-called system on chip (SoC) desig... » read more

DAC Is Where?

By Atrenta - 09 May, 2013 - Comments: 0

By Mike Gianfagna DAC season is upon us. I gave up counting the number of DACs I’ve attended a long time ago—when I turned 29 for the third time, I believe. This year, DAC is special in a few important ways. First of all, it’s the 50th DAC. Yes, the show has indeed been around that long. It started as a workshop with a bunch of engineers debating algorithms. For an industry that is arg... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: RTL signoff

Achieve 10X Faster CDC Debug Leveraging Machine Learning

Achieving Faster Closure With Reduced Setup And Debug Using Advanced RTL Static Signoff Platform

Shift Left Verification With Comprehensive Lint Signoff

ROI Not There Yet For SysML

Do SoCs Need Earthquake Insurance?

DAC Is Where?

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