How advanced RTL static signoff speeds closure.
Many design houses are continually seeking ways to shorten their effective design cycle to address demanding market requirements, gain a formidable technological advantage, and secure leadership in their respective industries. This pressure can cause designers to get extremely overwhelmed by strict timelines. To meet tight project timelines, design teams often resort to identifying industry-leading tools that will best meet their needs and give them access to advanced tool capabilities, high performance, and memory optimizations. While these capabilities and optimizations are indeed beneficial, important setup and debug efforts are often overlooked and can substantially impact project timelines.
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The more compute power, the better. But what’s the best way to get there?
Yield rises with mask protection; multiple sources will likely reduce costs.
More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.
CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.
Computational storage approaches push power and latency tradeoffs.
Gate-all-around FETs will replace finFETs, but the transition will be costly and difficult.
An upbeat industry at the start of the year met one of its biggest challenges, but instead of being a headwind, it quickly turned into a tailwind.
The backbone of computing architecture for 75 years is being supplanted by more efficient, less general compute architectures.
How long a chip is supposed to function raises questions design teams need to think about, including how much they trust aging models.
New interconnects and processes will be required to reach the next process nodes.
After failing in the fab race, the country has started focusing on less capital-intensive segments.
Servers today feature one or two x86 chips, or maybe an Arm processor. In 5 or 10 years they will feature many more.
SRC’s new CEO sheds some light on next-gen projects involving everything from chiplets to hyperdimensional computing and mixed reality.
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