tag: Samsung Foundry

Week In Review: Design, Low Power
By Jesse Allen - 06 Jul, 2018 - Comments: 0

CAST debuted an IP subsystem implementing the latest IEEE standards for Time Sensitive Networking (TSN) over Ethernet. The TSN_CTRL Subsystem combines three IP cores, a time synchronizer, traffic shaper, and Ethernet MAC. It implements a hardware subsystem that operates without software assistance once programmed. The IP communicates timing information to the system, and allows the system to de... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Jun, 2018 - Comments: 0

M&A Siemens acquired Austemper Design Systems, which provides tools for functional safety and safety-critical designs. Founded in 2015, Texas-based Austemper adds state-of-the-art safety analysis, auto-correction and fault simulation technology to address random hardware faults, as well as correct and harden vulnerable areas, subsequently performing fault simulation to ensure the design is... » read more

The Week In Review: Design
By Jesse Allen - 15 Jun, 2018 - Comments: 0

M&A MIPS has reportedly been acquired again, this time by AI startup Wave Computing. Wave focuses on data center-based neural network training using its parallel dataflow processing architecture. In March, the company signed on to use 64-bit multi-threaded processor cores from MIPS in future projects. Previously, MIPS was owned by Tallwood Venture Capital, which acquired MIPS from Imaginat... » read more

The Week In Review: Design
By Jesse Allen - 25 May, 2018 - Comments: 0

Tools & IP Cadence and National Instruments are teaming up with the aim of improving the semiconductor development and test process. The two companies are jointly working on common transistor models to ensure consistent simulation behavior between NI AWR Microwave Office circuit design software and the Cadence Spectre simulation platform. Cadence also launched the Virtuoso RF Solution for ... » read more

Quantum Effects At 7/5nm And Beyond
By Ed Sperling - 23 May, 2018 - Comments: 5

Quantum effects are becoming more pronounced at the most advanced nodes, causing unusual and sometimes unexpected changes in how electronic devices and signals behave. Quantum effects typically occur well behind the curtain for most of the chip industry, baked into a set of design rules developed from foundry data that most companies never see. This explains why foundries and manufacturing e... » read more

Multi-Die Packaging And Thermal Superposition Modeling
By eSilicon - 25 Apr, 2018 - Comments: 0

Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

Samsung Unveils Scaling, Packaging Roadmaps
By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

Reworking Established Nodes
By Ed Sperling - 24 May, 2017 - Comments: 2

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

The Week In Review: Design
By Jesse Allen - 03 Jun, 2016 - Comments: 0

Tools Mentor Graphics uncorked the latest version of its Catapult high-level synthesis platform, adding a formal-based C Property Checker tool to automatically identify and formally prove hard-to-find issues like uninitialized memory, divide by 0, and array bounds errors in the users' HLS C++/SystemC model. IP ARM unveiled the Cortex-A73 and Mali-G71 processors. According to ARM, the g... » read more

The Week In Review: Design/IoT
By Jesse Allen - 15 Apr, 2016 - Comments: 0

Mergers & Acquisitions Cadence acquired [getentity id="22444" comment="Rocketick"], an Israel-based company focused on multicore parallel simulation. Founded in 2008, their original rise and claim to fame was acceleration on GPUs, having received significant funding from Nvidia. The deal is expected to close in the second quarter of fiscal 2016, and terms were not disclosed. Tools &am... » read more

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