tag: Samsung

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Jun, 2021 - Comments: 0

Automotive Cadence will be capturing design insights from Presto Engineering, an ASIC designer working on high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto, which also provides semiconductor services such as test and qualification, will use Cadence’s EDA and analysis tools (Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity Xt... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

More Fabs Seen In Chip Boom
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Over the last year, the semiconductor industry has seen an amazing turnaround. The industry happens to be in a boom cycle. Today, chip demand remains strong. And some fab projects have been accelerated to meet this demand, according to Christian Dieseldorff, an analyst at SEMI. It wasn’t always this way. In early 2020, the business looked bright, but the IC market dropped amid the Covid... » read more

Shifting Toward Data-Driven Chip Architectures
By Ed Sperling and Ann Mutschler - 16 Jun, 2021 - Comments: 0

An explosion in data is forcing chipmakers to rethink where to process data, which are the best types of processors and memories for different types of data, and how to structure, partition and prioritize the movement of raw and processed data. New chips from systems companies such as Google, Facebook, Alibaba, and IBM all incorporate this approach. So do those developed by vendors like Appl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jun, 2021 - Comments: 0

Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

The Increasingly Uneven Race To 3nm/2nm
By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Demand, Lead Times Soar For 300mm Equipment
By Mark LaPedus - 20 May, 2021 - Comments: 0

A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

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