tag: Samsung

Stronger, Better Bonding In Advanced Packaging
By Katherine Derbyshire - 21 Jan, 2021 - Comments: 1

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less practical. In thermocompression bonding, protruding copper bumps bond to pads on the underlying substrate. In hybrid bonding, copper pads are inlaid in a dielectric, reducing the risk of oxidation. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Jan, 2021 - Comments: 0

Chipmakers and OEMs Intel has appointed Pat Gelsinger as its new chief executive, effective Feb. 15. Gelsinger will also join Intel’s board upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15. Most recently, Gelsinger served as the CEO of VMware since 2012. He also spent 30 years at Intel, becoming the company’s first chief technology officer. The move fo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 15 Jan, 2021 - Comments: 0

Automotive/Mobility Tesla has to recall 158,000 2012-2018 Model S and 2016-2018 Model X vehicles because of an eMMC NAND flash memory chip. The chip can cause the touchscreen to stop working when the memory reaches its limit of writes. According to a story in Reuters, the United States NHTSA (National Highway Traffic Safety Administration) is insisting on the recall because many of Tesla contr... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Dec, 2020 - Comments: 0

Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

Variation Threat In Advanced Nodes, Packages Grows
By Ed Sperling - 21 Dec, 2020 - Comments: 0

Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Dec, 2020 - Comments: 0

Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Dec, 2020 - Comments: 0

Government policy--semiconductors Eighteen members of the European Union have launched an initiative to boost the EU’s efforts in processors and semiconductor technologies. The member nations will also work together to bolster leading-edge manufacturing capacity. The EU plans to invest up to $145 billion in the effort. “Europe has all it takes to diversify and reduce critical dependenci... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Nov, 2020 - Comments: 0

Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy