Week In Review: Design, Low Power

By Jesse Allen - 13 Mar, 2020 - Comments: 0

Tools & IP Synopsys revealed DSO.ai (Design Space Optimization AI), an autonomous AI application that searches for optimization targets in very large solution spaces of chip design, inspired by the process of DeepMind's game-playing AlphaZero. DSO.ai engines ingest large data streams generated by chip design tools and use them to explore search spaces, observing how a design evolves over t... » read more

Aging Analysis Standard Solidifies Through Collaborative Effort

By Ahmed Ramadan - 12 Mar, 2020 - Comments: 0

By Ahmed Ramadan, Greg Curtis, Harrison Lee, Jongwook Kye, and Sorin Dobre We live in a connected world and it is estimated that by 20251 the total amount of worldwide data will swell to 163 ZB, or 163 trillion gigabytes. This rapid growth in data expansion is driving an explosion in new designs and new requirements for consumer, data center, automotive, and Internet of Things (IoT) applicat... » read more

Taming Novel NVM Non-Determinism

By Bryon Moyer - 10 Mar, 2020 - Comments: 1

New memory technologies may have non-deterministic characteristics that add calibration to the test burden — and may require recalibration during their lifetime. Many of these memories are in development as a result of the search for a storage-class memory (SCM) technology that can bridge the gap between larger, slower memories like flash and faster DRAM memory. There are several approache... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 06 Mar, 2020 - Comments: 0

Fab tools, materials and packaging Intel has recognized 37 companies for its annual suppliers’ awards. The list includes equipment, materials, packaging houses and other segments. These suppliers have collaborated with Intel to implement process improvements with good products and services. See who made the list here. ---------------------------------------- Lam Research has introduced... » read more

Week In Review: Design, Low Power

By Jesse Allen - 06 Mar, 2020 - Comments: 0

Ansys will acquire Lumerical, a developer of photonic design and simulation tools. "The potential of photonics in applications like 5G, IIoT and autonomous vehicles can only be realized by solving immense multiphysics device and system challenges," said James Pond, co-CEO and CTO of Lumerical. "Together, Lumerical and Ansys are uniquely positioned to provide the necessary solutions, and custome... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Mar, 2020 - Comments: 0

Pervasive computing — health An injectable biosensor may someday help measure signs of influenza. DARPA (the U.S. Department of Defense’s Defense Advanced Research Projects Agency) and digital health startup Profusa announced a study that uses Profusa’s Lumee Oxygen Platform to find ways to identify flu outbreaks, biological attacks and pandemics as much as three weeks earlier than curre... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Feb, 2020 - Comments: 0

Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

What’s In Your IP?

By Ed Sperling - 21 Feb, 2020 - Comments: 0

Jeff Markham, software architect at ClioSoft, talks with Semiconductor Engineering about IP traceability in markets such as automotive and aerospace, what’s actually in IP, what should not be in that IP from a security standpoint, and how all of this data can used to avert system reliability issues in the future. » read more

The Risk Of Two Supply Chains

By Ed Sperling - 20 Feb, 2020 - Comments: 0

Ever since the Trump administration weaponized trade restrictions against individual companies — first ZTE, then Huawei — China has begun developing a second supply chain for electronics. Inside of China, this is viewed as a necessary step for survival. In April 2018, the U.S. government banned ZTE from sourcing U.S. components for seven years, nearly putting that company out of business... » read more

MOCVD Vendors Eye New Apps

By Mark LaPedus - 20 Feb, 2020 - Comments: 0

Several equipment makers are developing or ramping up new metalorganic chemical vapor deposition (MOCVD) systems in the market, hoping to capture the next wave of growth applications in the arena. Competition is fierce among the various MOCVD equipment suppliers in the market, namely Aixtron, AMEC and Veeco. In addition, MOCVD equipment suppliers are looking for renewed growth in 2020, but b... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Samsung

Week In Review: Design, Low Power

Aging Analysis Standard Solidifies Through Collaborative Effort

Taming Novel NVM Non-Determinism

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

What’s In Your IP?

The Risk Of Two Supply Chains

MOCVD Vendors Eye New Apps