Designing Automotive ICs For Cybersecurity


The day has already arrived when we need to be concerned about the cybersecurity of our cars. An average modern car includes about 1400 ICs and many of them are used in sophisticated applications, like autonomous driving and vehicle-to-everything (V2X) communication. The security of road vehicles is an important issue to automakers and OEMs but is rooted in the IC devices that power the vehicle... » read more

2023 Open Source Security And Risk Analysis Report


The annual “Open Source Security and Risk Analysis” (OSSRA) report, now in its 8th edition, examines vulnerabilities and license conflicts found in roughly 1,700 codebases across 17 industries. The report offers recommendations for security, legal, risk, and development teams to better understand the security and risk landscape accompanying open source development and use. Click here to ... » read more

Causes Of Memory Unsafety


Memory unsafety is a characteristic of many of today’s systems. The root cause of buffer bounds vulnerabilities such as buffer overflows and over-reads is unsafe programming. Major software vendors consistently report memory unsafety problems. For example, the Chromium open-source browser project has stated that 69% of CVEs (Common Vulnerabilities and Exposures) reported relate to memory... » read more

Why Using Commercial Chiplets Is So Difficult


Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Integration Challenges For ATE Data


Tighter integration of automatic test equipment (ATE) into semiconductor manufacturing, so that data from one process can be seamlessly leveraged by another, holds significant promise to boost manufacturing efficiency and yield. The challenge is selling this concept to fabs, packaging houses, and their customers. Data involving yield parameters, process variations, and intricate details abou... » read more

Securing Automotive Ethernet Connections With MACsec


Zonal architecture in automotive design has become common in recent years in response to the increasing complexity of in-vehicle electrical systems. Automotive Ethernet is used to connect sensors and actuators to zonal gateways in ADAS (Advanced Driver Assistance Systems) enabled vehicles. With multi-gigabit links, it further connects zonal gateways to the central compute units that handle ADAS... » read more

Protecting Highly Confidential Data In IoT Devices


How should we approach the protection of highly confidential security parameters and personal data? It's just like our daily routines: when we leave home, we lock the door and take care not to lose the key. Similarly, in the realm of cybersecurity, safeguarding cryptographic keys is paramount. No matter how robust your data protection system is, it's rendered ineffective if keys or passwords... » read more

Securing Automotive Ethernet With MACsec Silicon IP


In today’s cars, the Ethernet standard is the go-to solution for connecting zonal gateways to the central compute units that handle ADAS functionality. However, in-vehicle networks are vulnerable to a number of security threats, including eavesdropping, denial-of-service attacks, man-in-the middle attacks, and unauthorized access. This white paper explores how MACsec provides an effective sol... » read more

Data Management Challenges In Heterogeneous Systems


Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice presiden... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

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