Week In Review: Design, Low Power


Tools and IP Electronic system design revenue hit a record $3.75 billion in the second quarter, according to a report from ESD Alliance, a SEMI Technology Community. That number represents a 17.5% year-over-year increase. Walden C. Rhines, the report’s executive sponsor, said it was the largest such jump in over a decade and that all product categories and geographic regions recorded second ... » read more

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body


By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Blog Review: Oct. 19


Siemens EDA's Harry Foster examines trends related to various aspects of FPGA design and the growing design complexity associated with increasing number of embedded processor cores, asynchronous clock domains, and more safety features. Synopsys' Twan Korthorst and Kenneth Larsen take a broad look at silicon photonics, including the benefits of electronic integration, accelerating the develop... » read more

EDA, IP Revenue Way Up


EDA and semiconductor IP sales grew 17.5% to $3.75 billion in Q2, the highest growth in more than a decade, fueled by more complex designs and the need for advanced design and verification tools. Demand for nearly every segment tracked in SEMI's Electronic Design Market Data (EDMD) report was up, including services, which grew 23.2% in Q2 — the most recent statistics available in. That cou... » read more

Week In Review: Semiconductor Manufacturing, Test


The United States imposed further export controls aimed at preventing foreign firms from selling advanced chips to China or supplying Chinese firms with semiconductor processing tools. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. Officials noted that they h... » read more

Blog Review: Oct. 12


Synopsys' Richard Solomon, Madhumita Sanyal, and Gary Ruggles take a look at the possibilities that CXL 3.0 can bring to a variety of data-driven applications that demand increasingly higher levels of memory capacity, with higher bandwidth, more security, and lower latency. Siemens EDA's Rich Edelman provides some tips for debugging UVM testbenches, such as how to determine what line changed... » read more

Blog Review: Oct. 5


Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Blog Review: Sept. 28


Cadence's Paul McLellan shares more highlights from the recent Hot Chips, including some very large chips and accelerators for AI and deep learning, new networks and switches, and mobile and edge processors. Synopsys' Marc Serughetti considers the different use cases for digital twins in automotive and how they can help determine the impact of software on verification, test, and validation a... » read more

Blog Review: Sept. 21


Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Smart Manufacturing And Advanced Technical Service


SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel:... » read more

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