tag: SEMI

Blog Review: July 21
By Jesse Allen - 21 Jul, 2021 - Comments: 0

Cadence's Paul McLellan listens in as Partha Ranganathan of Google argues that a new era of Moore's Law is emerging, defined both by the efficient design of hardware accelerators and improving the ways that hardware is utilized. Siemens EDA's Chris Spear continues exploring classes in SystemVerilog with a look at the relationship between the class variables that point to an object and how to... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Jul, 2021 - Comments: 0

Chipmakers The chip industry is buzzing over a Wall Street Journal report that Intel is in talks to buy GlobalFoundries (GF) for $30 billion. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel planned to jumpstart its foundry business within its own fabs. But it... » read more

EDA, IP Numbers In Record Territory
By Ed Sperling - 16 Jul, 2021 - Comments: 0

EDA and semiconductor IP revenue soared to a new high, up 17% worldwide in Q1 compared to the same period in 2020, with revenue in China surging 73%, according to new data from SEMI's Electronic System Design Alliance. For many financial reports outside of semiconductors, strong growth numbers can be misleading because they reflect comparatively weak earnings stemming from pandemic-related s... » read more

Blog Review: July 14
By Jesse Allen - 14 Jul, 2021 - Comments: 0

Siemens EDA's Wei-Lii Tan considers the tradeoffs when running library characterization in the cloud and how to think about running CPUs in parallel, the cost of throughput, and runtime reductions. A Synopsys writer checks out the reduced blanking feature in HDMI 2.1, which can help reduce the transmission rate while keeping the resolution and refresh rate intact for higher resolution displa... » read more

CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets
By Ed Sperling - 14 Jul, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, longer IC lifetimes, and a spike in the number of end applications with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; an... » read more

Blog Review: July 7
By Jesse Allen - 07 Jul, 2021 - Comments: 0

Cadence's Sangeeta Soni provides a primer on the PIPE SerDes architecture and some of the changes that can introduce verification challenges for SerDes compliant PHY and MAC devices. Siemens EDA's Chris Spear demystifies the $cast() method in SystemVerilog, which checks values at runtime rather than compile time, and gives some examples of when it is useful. Synopsys' Chris Clark warns th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Jul, 2021 - Comments: 0

Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

Blog Review: June 30
By Jesse Allen - 30 Jun, 2021 - Comments: 0

Siemens EDA's Chris Spear considers what classes should represent in SystemVerilog and offers two major categories along with some helpful UVM tips. Cadence's Paul McLellan listens in on keynotes at the recent TSMC Technology Symposium, including TSMC CEO C. C. Wei's introduction some of the fab's new offerings, such as an automotive-focused N5 process. Synopsys' Dennis Kengo Oka notes th... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Jun, 2021 - Comments: 0

Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

Blog Review: June 23
By Jesse Allen - 23 Jun, 2021 - Comments: 0

Synopsys' Manuel Mota shows how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can benefit hyperscale data centers. Siemens EDA's Chris Spear explains the relationship between classes and objects in SystemVerilog with a handy visualization and notes the difference between SystemVerilog ... » read more

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