tag: SEMI

Blog Review: Jan. 5
By Jesse Allen - 05 Jan, 2022 - Comments: 0

Cadence's Paul McLellan listens in on the challenges Tesla sees in manufacturing batteries for electric vehicles at scale and the types of battery chemistries it are currently using. Synopsys' Mark Kahan finds out the launch steps involved with the James Webb Space Telescope and the role of optical design software in creating the new instruments for Near IR and Mid IR sensing. Siemens' An... » read more

Blog Review: Dec. 21
By Jesse Allen - 21 Dec, 2021 - Comments: 0

Cadence's Paul McLellan points to Log4J, a logging utility with a new major vulnerability that could affect hundreds of millions of devices, what's being done to address it, and why the underlying problems may be around for decades. Siemens EDA's Ray Salemi continues explaining how to use Python for verification by checking out the Python logging module for pyuvm and how it compares to UVM r... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Dec, 2021 - Comments: 0

Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Dec, 2021 - Comments: 0

Automotive Features of Toyota’s key fobs for entering vehicles get turned off when drivers do not start paying a subscription fee when the complementary subscriptions end, says an article in Ars Technica. SiLC Technologies announced its compact Eyeonic Vision Sensor, a FMCW lidar sensor, is now commercially available. The sensor has a silicon photonic chip that keeps a lidar’s size down... » read more

Covid Masks And Forecasts At Semicon
By Mark LaPedus - 16 Dec, 2021 - Comments: 0

Semicon West 2021 was certainty different, if not surreal, this year. The annual event was held in-person from Dec. 7-9, although there is a virtual component that runs until Jan. 7, 2022. In comparison, Semicon West was an all-virtual event in 2020, due to the Covid-19 pandemic. At this year’s in-person event in San Francisco, attendees, exhibitors and speakers were all required to wea... » read more

Chillers: A Cooling Product But Temperatures Still Rising
By John West - 16 Dec, 2021 - Comments: 0

In what has been an incredible ride over the past five years for everyone in the semiconductor supply chain, suppliers of chillers have shined as standout performers. These cooling systems that are stuck in the sub-fab space under the clean rooms get little attention, yet revenues have more than doubled in the past five years, clocking a compound annual growth rate of 22% to reach $635 million ... » read more

Blog Review: Dec. 15
By Jesse Allen - 15 Dec, 2021 - Comments: 0

Arm's Hannah Peeler, Joshua Randall, and Zach Lasiuk examine the carbon cost of data centers and introduce a tool that allows users to make informed decisions about the carbon impact of their compute workloads. Synopsys' Kenneth Larsen provides a primer on the fundamentals of quantum computing, the role of photonics in building quantum systems, and the future potential impact on chip design.... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

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