tag: SEMI

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Blog Review: June 2
By Jesse Allen - 02 Jun, 2021 - Comments: 0

Synopsys' Mike Borza checks out how automotive ECUs, infotainment systems, and in-vehicle networks can be compromised by attackers and why it’s important to follow cybersecurity best practices and keep security in mind starting early in the design cycle. Cadence's Paul McLellan checks out the results from the latest MLPerf benchmarks for machine learning inference systems, with the new inc... » read more

Continuing Challenges For Open-Source Verification
By Brian Bailey - 01 Jun, 2021 - Comments: 1

Experts at the Table: This is the last part of the series of articles derived from the DVCon panel that discussed Verification in the Era of Open Source. It takes the discussion beyond what happened in the panel and utilizes some of the questions that were posed, but never presented to the panelists due to lack of time. Contributing to the discussion are Ashish Darbari, CEO of Axiomise; Serge L... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

Blog Review: May 26
By Jesse Allen - 26 May, 2021 - Comments: 0

Cadence's Paul McLellan checks out challenges in designing processors for AI applications, the explosion in the number of weights used to language processing, and the current state of training and inference hardware. Synopsys' Mike Gianfagna explores how hyper-convergent design will push device capabilities through integration of multiple technologies, multiple protocols, and multiple archit... » read more

The Increasingly Uneven Race To 3nm/2nm
By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Demand, Lead Times Soar For 300mm Equipment
By Mark LaPedus - 20 May, 2021 - Comments: 0

A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

Robust Growth And Strong Outlook For Semiconductor Materials
By Inna Skvortsova - 20 May, 2021 - Comments: 0

2020 was a year that made a mark in the history of mankind as well as the semiconductor industry. It was a year of business and personal disruptions caused by COVID-19, supply chain interruptions, and exceptional agility of industries coping with the new normal imposed by the pandemic. Nevertheless, it was a year of extraordinary growth for the semiconductor industry, including semiconductor ma... » read more

Blog Review: May 19
By Jesse Allen - 19 May, 2021 - Comments: 0

Cadence's Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S. In a podcast, Siemens EDA's Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardw... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 14 May, 2021 - Comments: 0

Security A ransomware attack shutdown 5,500 miles of gas pipeline in the eastern United States for a week and sparked some panic buying and an executive order from U.S. President Biden. The Colonial Pipeline Co. paid nearly $5 million in ransom to Eastern European hackers, according to Bloomberg article. The hacker group DarkSide was responsible, members of whom the U.S. government believes li... » read more

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