tag: SEMI

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Nov, 2019 - Comments: 0

Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Blog Review: Oct. 30
By Jesse Allen - 30 Oct, 2019 - Comments: 0

Cadence's Paul McLellan checks out the future of the automotive industry, the options for making the transition to autonomous driving, and how experience with electric vehicles influences perception of them. In a video, Mentor's Colin Walls digs into the challenges of testing memory in an embedded system. A Synopsys writer looks at doubling bandwidth in PCIe 5.0, the PHY logical changes a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Oct, 2019 - Comments: 0

Fab tools It’s been a tough period for memory. But is there now a sign of a rebound? For the September 2019 quarter, Lam Research reported revenue of $2.166 billion, and net income was $466 million, or $3.09 per diluted share on a U.S. GAAP basis. The outlook at Lam (LRCX) is a bright spot. “LRCX posted strong results and guidance, noting strength from logic and foundry in the December ... » read more

Blog Review: Oct. 23
By Jesse Allen - 23 Oct, 2019 - Comments: 0

ANSYS' Magdy Abadir digs into the challenges associated with identifying and modeling electromagnetic crosstalk and the architectural and design trends that contribute to it. Cadence's Paul McLellan listens in as automotive security expert Charlie Miller points to how close we are to Level 4 autonomy and where in a car attack surfaces lie. Mentor's Brent Klingforth checks out the process ... » read more

Printed Sensor Market Expands
By Nick Skelton - 17 Oct, 2019 - Comments: 0

The growing use of actionable information in new ways to make better decisions is driving brisk growth in printed electronics (PE) and sensors. According to BCC Research, the global market for sensors should grow from $173.4 billion in 2019 to reach $323.3 billion by 2024 – a compound annual growth rate (CAGR) of 13.3%. Where will this growth come from? Where are the immediate, and longer-... » read more

MEMS And Sensor Tech For The Next Decade
By Maria Vetrano - 17 Oct, 2019 - Comments: 0

Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder & Managing Member, A.M. Fitzgerald & Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development a... » read more

Blog Review: Oct. 16
By Jesse Allen - 16 Oct, 2019 - Comments: 0

Arm's Greg Yeric dives into the challenges facing the semiconductor industry and potential solutions that could possibly have huge impacts toward the year 2030, from DNA self-assembly to new physics, in an adaptation of his wide-ranging Arm TechCon keynote. Cadence's Paul McLellan considers Google's recent quantum computing achievement, what quantum supremacy really means, and where it leave... » read more

Blog Review: Oct. 9
By Jesse Allen - 09 Oct, 2019 - Comments: 0

In a video, Cadence's Tom Hackett continues his introduction to finite element analysis (FEA) and the important role it can play in electronics deign. Mentor's Colin Walls considers dynamic memory allocation in real-time operating systems and the problems of non-deterministic behavior and ill-defined failure modes. Synopsys' Taylor Armerding contends that ethical hackers are a necessary p... » read more

Reducing Costly Flaws In Heterogeneous Designs
By Ed Sperling - 08 Oct, 2019 - Comments: 0

The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

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