tag: SEMI

Optimizing Multiple IoT Layers
By Ann Mutschler - 01 Dec, 2016 - Comments: 0

As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Nov, 2016 - Comments: 0

R&D Amid budget cuts in the U.S. government, federal funding for R&D at higher education institutions in the United States declined for a fourth straight year, according to a new report from the National Center for Science and Engineering Statistics (NCSES). Overall, universities reported $68.8 billion in R&D expenditures in 2015, a 2.2% increase from 2014, according to the NCSES, part of t... » read more

Can We Measure Next-Gen FinFETs?
By Mark LaPedus - 21 Nov, 2016 - Comments: 6

After ramping up their respective 16nm/14nm finFET processes, chipmakers are moving towards 10nm and/or 7nm, with 5nm in R&D. But as they move down the process roadmap, they will face a new set of fab challenges. In addition to lithography and interconnects, there is metrology. Metrology, the science of measurements, is used to characterize tiny films and structures. It helps to boost yi... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Nov, 2016 - Comments: 1

Fab tools Is Nikon’s semiconductor lithography equipment business on the ropes? Amid losses and dwindling market share, the company has announced a major restructuring plan for this unit. It will reduce fixed costs related to its 193nm immersion scanner business “by headcount rationalization and re-assignments of 1,000 employees,” according to Nikon. In addition, Nikon is reassessing its... » read more

Watch Out For 200mm Fabs: Fab Outlook To 2020
By Christian Dieseldorff - 24 Oct, 2016 - Comments: 0

One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has just issued an October 2016 update with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity change worldwide.  Industry spending for construction and equipment is detailed and analy... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Oct, 2016 - Comments: 1

Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

Making Manufacturing Sustainable For Chips
By Katherine Derbyshire - 28 Sep, 2016 - Comments: 5

There is widespread agreement that fabs and manufacturers in general should operate in a sustainable way, but what exactly does that mean? And what concrete steps can fabs take toward that goal? Once we get past the simplistic “more sustainable is better,” things tend to get pretty fuzzy. Consider the definition of sustainability itself. Corporate responsibility reports and similar docum... » read more

NextFlex Takes High Profile With Events And First Round Of Project Announcements
By Heidi Hoffman - 22 Sep, 2016 - Comments: 0

NextFlex, FlexTech’s flexible hybrid electronics (FHE) manufacturing institute, has been headlining flexible electronics in a major way in the past few weeks. From hosting contingents from the White House and the Pentagon, Members of Congress and local dignitaries, to announcing new development projects and partners, this one-year old organization is off to a rapid start while highlighting ad... » read more

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