What’s On Your Holiday Gift List?

By Joanne Itow - 22 Oct, 2015 - Comments: 0

This month Semico reduced our semiconductor growth outlook for 2015 and 2016. The slowdown is mainly due to lower sales of electronic devices such as new convertible notebooks and even smartphones. TSMC reported near-term uncertainty due to higher than seasonal inventories, customers’ cautious inventory management, along with active inventory reductions. The new iPhone 6s and 6s Plus rolled o... » read more

What China Is Planning

By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

High-Speed Systems Need High-Speed Parts For Prototyping

By Rich Wawrzyniak - 12 Oct, 2015 - Comments: 0

One of the ironies of prototyping for high-speed system design using FPGAs is that in the past most FPGAs did not run at the speeds required by the end system. Many of these FPGAs today have high speed SerDes channels used for communicating with other elements of the system at close to the speeds specified by the designer. Unfortunately most of the FPGAs used for the prototyping phase of the sy... » read more

New System Requirements Demand a Creatively Choreographed Ecosystem

By Jim Feldhan - 17 Sep, 2015 - Comments: 0

In the past, integrated circuits, packages and boards were all designed independently, and yet in most cases still managed to fit together with very few functional or technical problems. However, recent advances in chip performance have changed this process dramatically. New designs, processes and materials already have been seen in packaging as high-performance semiconductor chips need to c... » read more

The Week In Review: Design/IoT

By Jesse Allen - 28 Aug, 2015 - Comments: 0

M&A Tessera boosted its 2.5D and 3D-IC capabilities with the acquisition of Ziptronix. The $39 million cash purchase adds a low-temperature wafer bonding technology platform, which has been licensed to Sony for volume production of CMOS image sensors. Numbers Semico Research forecasts that the SoC market will approach $200 billion by 2019. According to its analysis, average die are... » read more

What Will 7nm And 5nm Look Like?

By Mark LaPedus - 23 Jul, 2015 - Comments: 0

Citing an assortment of undisclosed manufacturing issues, Intel in July pushed out the introduction of its 10nm chip and process technology to the second half of 2017. This is roughly six or more months later than expected. With the delay at 10nm, [getentity id="22846" e_name="Intel"] also pushed out its process cadence from 2 to 2.5 years. Other foundries, meanwhile, are struggling to keep ... » read more

Surprises At SEMICON West

By Joanne Itow - 23 Jul, 2015 - Comments: 0

As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about. Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that are driving growth and excitement at semiconductor equipment... » read more

Challenges For The IIoT

By Ed Sperling - 07 May, 2015 - Comments: 0

Unlike the [getkc id="76" comment="Internet of Things"], which is largely still a collection of connected devices that don't always play well together, the Industrial Internet of Things ([getkc id="78" kc_name="IIoT"]) already is in heavy use and growing across a number of markets well outside of the usual markets associated with semiconductors. A Morgan Stanley "blue paper" report issued la... » read more

Predictions For A Good Year

By Jim Feldhan - 16 Apr, 2015 - Comments: 0

First quarter 2015 is now history, and companies will soon be reporting their Q1 earnings. Here at Semico we’ve checked the IPI Index against our forecast and year-to-date actuals to see if the industry outlook is on track for 2015. Here’s the critical review. First of all, Semico’s forecast for total semiconductor sales in 2015 is $378 billion, up nearly 9% over 2014. Units will incre... » read more

Full Steam Ahead For China Inc.

By Joanne Itow - 19 Mar, 2015 - Comments: 1

Were you in Shanghai this week? If not, you missed the biggest Semicon event in the world. Semicon China broke records this year. With more than 1,000 companies participating, and 570,000 square meters of exhibition space, Semicon China attracted more than 50,000 visitors, making it the largest Semicon event in the world. All the sessions we attended were standing room only. Key areas of fo... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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