Blog Review: Nov. 12

By Ed Sperling - 12 Nov, 2014 - Comments: 0

ARM's Eoin McCann provides a primer to software-defined networking, which uses a higher level of abstraction to create a centralized controller. This is a new twist on networking—with a bit of deja vu thrown in. Mentor's Matthew Ballance points to a perfect storm for verification—shrinking features, more layers and more embedded processors. He has some tips for how to deal with all of t... » read more

Blog Review: Oct. 22

By Ed Sperling - 22 Oct, 2014 - Comments: 0

What is UX? The User Experience, of course. Rambus' Aharon Etengoff notes that the IoT UX is now the subject of a Harvard Business Review article. A long list of hurdles are expected at the 10nm process node, including multiple levels of local interconnects, more complex layout rules, timing problems, and a slew of others. Cadence's Richard Goering puts it all in perspective. Mentor's R... » read more

Another Inventory Glut?

By Jim Feldhan - 16 Oct, 2014 - Comments: 0

For nearly a year, Semico’s IPI index has been indicating that the fundamental demand in the second half of 2014 would be seasonally weak. Back in early 2013, our initial view for 2014 was a 10% market growth. However, as the IPI declined in the second half of 2013 we revised our semiconductor revenue forecast down to 7.3% heeding the warning that was projected by the Semico IPI index. This w... » read more

Blog Review: Sept. 24

By Ed Sperling - 24 Sep, 2014 - Comments: 0

Cadence’s Brian Fuller captures Chris Rowen’s phylum classifications for data-efficient design—lots of insects and much bigger but fewer mammals. There are cognitive layers in between, as well. Check out the chart. Mentor’s Robin Bornoff digs into thermal runaway and how to determine when it will occur—and burn up a chip. There’s a video to illustrate just what can go wrong. ... » read more

How Chip Vendors Counter Security Vulnerabilities In The IoT

By Tony Massimini - 18 Sep, 2014 - Comments: 0

The objective of the Internet of Things is connectivity and interoperability of many connected devices. There is a large amount of data that is being generated. This data is transmitted from end devices, the “things,” through a network of gateways, routers, smartphones, PCs and other devices up to the cloud into vast databases. Many sources of little data develop into Big Data. Information ... » read more

Navigating The Used Equipment Market

By Mark LaPedus - 18 Sep, 2014 - Comments: 0

For years, the used semiconductor equipment market has been an important but obscure part of the IC manufacturing supply chain. In fact, nearly all chipmakers have bought used tools over the years. Buying used equipment is a quick and relatively inexpensive way to fill a particular need in both 200mm and 300mm fabs. But after years of flying under the radar, the used IC equipment market is h... » read more

Changing The IP Supplier Paradigm

By Brian Bailey - 17 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down with Rich Wawrzyniak, senior market analyst for ASIC and SoC at Semico Research; John Koeter, vice president of marketing for the Solutions Group at [getentity id="22035" e_name="Synopsys"]; Mike Gianfagna, vice president of marketing for [getentity id="22242" e_name="eSilicon"]; Peter McGuinness, director of technology marketing at [getentity id="22709" e_nam... » read more

Changing The IP Supplier Paradigm: Part 2

By Brian Bailey - 26 Aug, 2014 - Comments: 2

Blog Review: Aug. 20

By Ed Sperling - 20 Aug, 2014 - Comments: 0

Ansys’ Bill Vandermark highlights the top five engineering articles of the week. Check out the “Sprouting Baby Monitor.” This may be a sign of what the IoT is really good for. You can also use your cat (or dog or even your kids) to hack your neighbor’s Wi-Fi. Cadence’s Richard Goering says gaps may be narrowing between available tools and what’s needed for 3D-IC design. Now all w... » read more

FinFET Ramp: Changing Market Dynamics?

By Joanne Itow - 14 Aug, 2014 - Comments: 1

Rolling out a new semiconductor technology always has its share of challenges, but it seems like the 14nm finFET process node is starting off with more than its share of delays and speculation. This week Intel revealed some of the details for its new microarchitecture, Broadwell, and their first product, the Intel Core M processor, to be manufactured using their second-generation finFET, 14... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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