The Week In Review: Design

By Ed Sperling - 20 Jun, 2014 - Comments: 0

M&A Cadence completed its acquisition of Jasper Design Automation, using cash and revolving credit to finance the deal. It will explain the impact on 2014 financial results in fiscal 2015. Jasper’s team, led by CEO Kathryn Kranen, will now report to Cadence senior VP Charlie Huang in Cadence’s System & Verification Group. The deal was first announced in April. Tools Coverity un... » read more

Ethernet: The Highway For Automotive Electronics?

By Joanne Itow - 19 Jun, 2014 - Comments: 0

What happens when technology from the fast paced communication industry makes a move into the traditional automotive industry? Semiconductor marketers and even the automotive industry are talking about revolutionary changes inside and outside the vehicle. What kinds of changes? Ethernet and sensors. There’s a lot of excitement and enthusiasm over the prospect of cars with Ethernet networki... » read more

What Exactly Is The IoT?

By Ed Sperling - 12 Jun, 2014 - Comments: 0

The Internet of Things has drawn its share of attention. It has been overhyped, derided, and in some cases dismissed as the Internet of Silos. But the idea persists, and it’s catching on. So how much substance is there behind the hype? Best guess: Quite a bit. “We do see this as being a fast-growing market,” said Jim Feldhan, president of Semico Research. “The number of connected ... » read more

Blog Review: May 21

By Ed Sperling - 21 May, 2014 - Comments: 0

Mentor’s Colin Walls offers up some new insights into C++ exception handling, thanks to some input from colleague Jonathan Roelofs. This one involves minimizing overhead and reducing runtime penalties. Synopsys’ Mick Posner is back in the saddle again—literally. This is about as green as it gets. Cadence’s Arthur Marris reports back on the IEEE 802.3 Ethernet standards meeting, in... » read more

EDA Races To 7nm, Despite Litho Uncertainties

By Ann Mutschler - 16 May, 2014 - Comments: 0

It’s becoming almost painful to refer to the delay with EUV, but it certainly isn’t stopping anyone on the design side from tweaking design tools or working on test chips. Clearly, things are moving ahead to 7nm even though lithography plans aren't yet clear. Steve Carlson, group marketing director in Cadence’s Office of Chief Strategy, said with regard to EUV, “They have the power p... » read more

The Bumpy Road To FinFETs

By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

3D Printing Revolution Ahead

By Adrienne Downey - 15 May, 2014 - Comments: 0

The 3D printing industry has been getting loads of press recently. It has captured the imagination of many, with the possibility of starting a manufacturing revolution. New applications and materials are announced on a (very) frequent basis. ColorFabb will beta test two new filament materials, one based on bronze and the other bamboo, in the coming months. NASA and Tethers Unlimited are deve... » read more

Blog Review: May 14

By Ed Sperling - 14 May, 2014 - Comments: 0

Ansys’ Bill Vandermark highlights the top five engineering articles of the week. Of particular note is element No. 117, a new entry in the periodic table. The temporary name is ununseptium, which means…well, surprise…117. Cadence’s Brian Fuller follows a panel discussion about the biggest potential roadblock for the IoT’s success—privacy and security. You’ve been warned. Syn... » read more

Blog Review: May 7

By Ed Sperling - 07 May, 2014 - Comments: 0

What if your toothbrush could talk? Semico Research’s Michell Prunty looks at the crowd-funded connected toothbrush design. And what else can it do? Cadence’s Richard Goering attended the Electronic Design Process Symposium in Monterey and summed up the progress in ESL: Power is less of an issue (for the moment), emulation is cheaper, but there is still a dearth of expertise and standard... » read more

Blog Review: April 23

By Ed Sperling - 23 Apr, 2014 - Comments: 0

Mentor’s John Day looks backward through a smart rearview mirror from Nissan. No glare, even at night or at sunset, and a wider field of vision. You have to wonder why this technology took so long. Synopsys’ Karen Bartleson wonders when the IoT will actually arrive, given the delay in durable goods, a concern over security and the effects of government regulation. Answer: When we stop ta... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semico Research