Week In Review: Design, Low Power

By Jesse Allen - 31 Aug, 2018 - Comments: 0

Synopsys unveiled a new formal app, Regression Mode Accelerator, which uses machine learning algorithms to speed up formal property verification, as well as better convergence of formal proofs for subsequent runs. According to Synopsys, the app also allows for significant saving of compute resources in nightly regressions. Hitachi used OneSpin Solutions' 360 EC product family to verify vCOSS... » read more

Automotive Electronics: Driving The Semiconductor Market

By Jim Feldhan - 16 Aug, 2018 - Comments: 0

Automotive electronics is the fastest growing end application in the semiconductor market, but what systems will see the highest penetration rates? Currently, self-driving cars grab much of the media attention, and for good reason. Semico estimates that today’s self-driving car has $21,525 of additional electronics. However, recent tests of ADAS vehicles produced less than stellar results. II... » read more

Can AI Alter The Burgeoning Design Cost Trend?

By Rich Wawrzyniak - 21 Jun, 2018 - Comments: 0

Everyone in the semiconductor design arena has experienced or at least observed the impact of increasing costs for complex SoC silicon. Semico’s recently released report entitled "Silicon and Software Design Cost Analysis" reveals the cost associated with a first time design effort for a high-end, advanced performance multicore SoC using 7nm process technology can top $195M for both the silic... » read more

200mm Fab Crunch

By Mark LaPedus - 21 May, 2018 - Comments: 2

Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

AI Accelerating Discovery

By Joanne Itow - 25 Apr, 2018 - Comments: 0

In early April 2018, the Materials Research Society held their spring meeting and exhibit at the Phoenix, Arizona convention center. With more than 110 symposium presentations, it was difficult to select which sessions to attend. But one forum caught my eye, “AI for Materials Development”. These days AI seems to be everywhere. As we all speculate about the impact of AI on autonomous driv... » read more

Wafer Demand: Under Pressure But Still Growing

By Joanne Itow - 19 Mar, 2018 - Comments: 1

Wafer demand grew 10.7% in 2017 while total semiconductor units grew 13.4%. Due to the tight supply of silicon wafers and increased prices, most manufactures placed an even higher priority on improving yields. The industry’s focus on yield improvements is relentless but especially important when the cost of key input materials is on the rise. In 2017 the semiconductor products that con... » read more

SoC + AI = SiPx

By Rich Wawrzyniak - 15 Feb, 2018 - Comments: 0

The market for third-party semiconductor intellectual property (SIP) continues to exhibit growth well beyond the (CAGR) Compound Annual Growth Rate for the semiconductor industry. Semico just completed an in-depth analysis and breakdown of the SIP market in a report called Licensing, Royalty and Service Revenues For 3rd Party SIP (SC105-18). The 2017 to 2022 CAGR is projected to be 10.9%, about... » read more

Memory Market: Will History Repeat Itself?

By Joanne Itow - 24 Jan, 2018 - Comments: 0

While updating the Semico Fab Database and capital investment projections for 2018, China's investment in memory capacity sparked a lot of discussion at our weekly Semico roundtable. Will China's investment in memory production capacity be successful, or will it just ruin the party for all memory players? Here are some of the highlights of our discussion. Additional data and insights are includ... » read more

Getting Serious About Chiplets

By Ann Mutschler - 08 Jan, 2018 - Comments: 0

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Foundry Challenges in 2018

By Mark LaPedus - 27 Dec, 2017 - Comments: 6

The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semico Research