ML-Assisted IC Test Binning With Real-Time Prediction At The Edge


IC Test is a critical part of semiconductor manufacturing and proper die binning and material disposition has an important impact on the overall yield and on the process monitoring and failure mode diagnostics. Edge analytics are becoming an increasingly important aspect of die disposition. By intercepting parts in real-time at the wafer test step, we can save downstream processing needs. In th... » read more

AI-Driven Innovation For Manufacturing Automation


By Calvin Shiao, AshtonWS Huang, and Alfos Hsu Artificial intelligence (AI) is changing the world and improving our lives in many ways. The semiconductor industry is a key part of the AI revolution, as it provides powerful computing chips for AI applications and leverages AI to optimize business operations and management, customer service, office workflows, as well as the intricate realms of... » read more

Semiconductors Accelerate The Artificial Intelligence Revolution


By Ajit Manocha, Pushkar Apte, and Melissa Grupen-Shemansky Five years ago, SEMI published an article predicting that Artificial Intelligence (AI) would change everything – and it has! AI has moved out of labs and taken popular imagination by storm. It is now a hot topic of discussion everywhere, from family dining tables and corporate boardrooms to corridors of government. While it m... » read more

Using Deep Data For Improved Reliability Testing


Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Mor... » read more

Fabs Begin Ramping Up Machine Learning


Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases. Building robust models requires training the algorithms... » read more

Smart Manufacturing Advances The Next Generation Of Semiconductor Chips


Semiconductor devices are ubiquitous in our everyday lives and foundational to today’s communication, education, manufacturing, health, and transportation industries. From the moment our phone’s alarm clock wakes us up to unwinding by streaming our favorite shows, it’s difficult to imagine modern life without the devices that semiconductors enable. To keep pace with performance and ... » read more

Shaping A Sustainable $1 Trillion Era


The semiconductor industry remains on course to reach a total of US$1 trillion in global revenue by 2030, with the journey from US$600 billion expected to take just a decade. At the CEO Summit during SEMICON Europa 2023, SEMI Europe President Laith Altimime attributed this remarkable growth to powerful megatrends, most notably artificial intelligence (AI). AI, in turn, is creating new opport... » read more

Semiconductor Device Manufacturing Process Challenges And Opportunities


Semiconductor device manufacturing involves a complex series of processes that transform raw materials into finished devices. The process typically involves four major stages: wafer fabrication, wafer testing, assembly or packaging, and final testing. Each stage has its own unique set of challenges and opportunities. The semiconductor device manufacturing process faces several challenges, inclu... » read more

Rebalancing Test And Yield In IC Manufacturing


Balancing yield and test is essential to semiconductor manufacturing, but it's becoming harder to determine how much weight to give one versus the other as chips become more specialized for different applications. Yield focuses on maximizing the number of functional chips from a production batch, while test aims to ensure that each chip meets rigorous quality and performance standards. And w... » read more

Integration Challenges For ATE Data


Tighter integration of automatic test equipment (ATE) into semiconductor manufacturing, so that data from one process can be seamlessly leveraged by another, holds significant promise to boost manufacturing efficiency and yield. The challenge is selling this concept to fabs, packaging houses, and their customers. Data involving yield parameters, process variations, and intricate details abou... » read more

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