tag: Siemens Digital Industries Software

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Nov, 2022 - Comments: 0

Automotive, mobility Saudi Arabia has launched an electric vehicle (EV) company called Ceer. The company is a joint venture between the Public Investment Fund (PIF) of Saudia Arabia and Foxconn (Hon Hai Precision Industry Co.). SiMa.ai, a four-year-old startup that designs edge machine learning SoCs used in vision applications, is getting into the automotive assisted driving market. The com... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Oct, 2022 - Comments: 0

This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Oct, 2022 - Comments: 0

Cadence unveiled a new environment to automate and accelerate the complete design closure cycle from signoff optimization through routing, static timing analysis (STA), and extraction. The Certus Closure Solution allows concurrent, full-chip optimization through a massively parallel and distributed architecture and engine shared with Cadence’s Innovus Implementation System and the Tempus Timi... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues
By Karen Heyman - 11 Oct, 2022 - Comments: 0

Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 30 Sep, 2022 - Comments: 0

Automotive Renesas announced its integrated development environment (IDE), which car companies can use to develop automotive software for electronic control units (ECUs) with multiple devices, but for which the hardware has not been specified yet. The IDE has co-simulation, debug and trace, high-speed simulation and distributed processing software over multiple SoCs and MCUs. The first develop... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 23 Sep, 2022 - Comments: 0

On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Sep, 2022 - Comments: 0

Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Why Geofencing Will Enable L5
By Marie C. Baca - 19 Sep, 2022 - Comments: 1

What will it take for a car to be able to drive itself anywhere a human can? Ask autonomous vehicle experts this question and the answer invariably includes a discussion of geofencing. In the broadest sense, geofencing is simply a virtual boundary around a physical area. In the world of self-driving cars, it describes a crucial subset of the operational design domain — the geographic regio... » read more

Designing For Thermal
By Karen Heyman - 13 Sep, 2022 - Comments: 0

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

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