tag: Siemens EDA

Blog Review: May 15
By Jesse Allen - 15 May, 2024 - Comments: 0

Cadence's Anika Sunda suggests that RISC-V has opened numerous doors for innovation and believes EDA tools can help bridge the knowledge gap and foster a growing community of RISC-V developers. Synopsys' Alessandra Costa chats with industry experts about challenges facing analog design, what's needed for multi-die designs, and the potential of AI. Siemens' Bill Ji explains why understandi... » read more

Reset Domain Crossing Verification
By Reetika - 13 May, 2024 - Comments: 0

By Reetika and Sulabh Kumar Khare To meet low-power and high-performance requirements, system on chip (SoC) designs are equipped with several asynchronous and soft reset signals. These reset signals help to safeguard software and hardware functional safety as they can be asserted to speedily recover the system onboard to an initial state and clear any pending errors or events. By definiti... » read more

SRAM Security Concerns Grow
By Karen Heyman - 09 May, 2024 - Comments: 0

SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts from planar SoCs to heterogeneous systems in package, such as those used in AI or edge processing, where chiplets frequently have their own memory hi... » read more

Software-Defined Vehicle Momentum Grows
By Ann Mutschler - 09 May, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Advancing Automotive Functional Safety Through Analog & Mixed-Signal Fault Simulation
By Siemens EDA - 09 May, 2024 - Comments: 0

The automotive industry is undergoing a major transformation, driven by the rise of electric vehicles, ADAS, connected cars, and autonomous vehicles. Due to the safety-critical nature of automotive applications, the reliability and tolerance to faults in semiconductor designs becomes paramount. This white paper delves into the role of analog fault simulation in the context of automotive functio... » read more

Blog Review: May 8
By Jesse Allen - 08 May, 2024 - Comments: 0

Synopsys' Manuel Mota and Michael Posner look to UCIe as a complete stack for the die-to-die interconnect in multi-die chip designs, finding it can help maintain latency while reducing power and enhancing performance along with providing assurance of interoperability. Cadence's Durlov Khan highlights the Octal SPI interface for serial NAND flash, which enables 8-bit wide high bandwidth synch... » read more

Can Models Created With AI Be Trusted?
By Brian Bailey - 06 May, 2024 - Comments: 0

EDA models that are created using AI need to pass more stringent quality and cost benefit analysis compared to many AI applications in the broader industry. Money is hanging on the line if AI gets it wrong, and all the associated costs must be factored into the equation. Models are some of the most expensive things a development team can create, and it is important to understand the value th... » read more

Blog Review: May 1
By Jesse Allen - 01 May, 2024 - Comments: 0

Cadence's Vatsal Patel stresses the importance of having testing and training capabilities for high-bandwidth memory to prevent the entire SoC from becoming useless and points to key HBM DRAM test instructions through IEEE 1500. In a podcast, Siemens' Stephen V. Chavez chats with Anaya Vardya of American Standard Circuits about the growing significance of high density interconnect and Ultra ... » read more

Multi-Die Design Pushes Complexity To The Max
By Ann Mutschler - 29 Apr, 2024 - Comments: 1

Multi-die/multi-chiplet design has thrown a wrench into the ability to manage design complexity, driving up costs per transistor, straining market windows, and sending the entire chip industry scrambling for new tools and methodologies. For multiple decades, the entire semiconductor design ecosystem — from EDA and IP providers to foundries and equipment makers — has evolved with the assu... » read more

EDA Looks Beyond Chips
By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

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