Heterogeneous Integration Finding Its Footing

By Ed Sperling - 19 Oct, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

Why Using Commercial Chiplets Is So Difficult

By Ed Sperling - 18 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

RISC-V Wants All Your Cores

By Brian Bailey - 12 Oct, 2023 - Comments: 0

RISC-V is no longer content to disrupt the CPU industry. It is waging war against every type of processor integrated into an SoC or advanced package, an ambitious plan that will face stiff competition from entrenched players with deep-pocketed R&D operations and their well-constructed ecosystems. When Calista Redmond, CEO for RISC-V International, said at last year's summit that RISC-V w... » read more

Do You Really Understand The Importance Of Parasitic Extraction In Chip Designs?

By Karen Chow - 12 Oct, 2023 - Comments: 0

By Susanne Lachenmann and Petya Aleksandrova, Infineon Technologies, and Karen Chow, Siemens EDA One of the biggest challenges integrated circuit (IC) designers face in today’s complex designs is effectively managing the effects of parasitic elements such as resistance, capacitance, and inductance. Parasitic elements can significantly impact chip performance of a chip, making it critical f... » read more

The Value Of Field Solvers In Semiconductor Development Helps Drive Infineon Innovation

By Siemens EDA - 11 Oct, 2023 - Comments: 0

Parasitic extraction (PEX) helps ensure accurate circuit performance in the design and verification flow. Development of accurate PEX runsets depends on accurate and precise extraction results obtained using a full-featured field solver. Infineon selected the Calibre xACT 3D tool as their reference field solver tool of choice in the development of their next-generation semiconductor power produ... » read more

Blog Review: October 11

By Jesse Allen - 11 Oct, 2023 - Comments: 0

Cadence's Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination. Synopsys' Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators. Siemens' Kevin Webb expla... » read more

Simplifying Power Module Verification Using Compliance Checking

By Wilfried Wessel - 05 Oct, 2023 - Comments: 0

By Wilfried Wessel, Siemens EDA; Simon Liebetegger, University of Applied Sciences, Darmstadt; and Florian Bauer, Siemens EDA Current simulation and verification methods for power modules are time-consuming. Each domain has specific solutions based on finite elements analysis, computational fluid dynamics and solvers for electric circuits like SPICE. This article investigates if it is possib... » read more

How Much AI Is Really Needed?

By John Koon - 05 Oct, 2023 - Comments: 0

Tensor Core GPUs have created a generative AI model gold rush. Whether it’s helping students with math homework, planning a vacation, or learning to prepare a six-course meal, generative AI is ready with answers. But that's only one aspect of AI, and not every application requires it. AI — now an all-inclusive term, referring to the process of using algorithms to learn, predict, and make... » read more

Making Sensors More Reliable

By Karen Heyman - 05 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the latest issues in sensors with Prakash Madhvapathy, director of product marketing, Tensilica audio/voice DSPs group at Cadence; Kevin Hughes, senior product manager for MEMS sensors at Infineon; and Matthew Hogan, product management director at Siemens EDA. What follows are excerpts of that conversation. [L-R] Kevin ... » read more

Gearing Up For Level 4 Vehicles

By John Koon - 05 Oct, 2023 - Comments: 0

More autonomous features are being added into high-end vehicles, but getting to full autonomy will likely take years more effort, a slew of new technologies — some of which are not in use today, and some of which involve infrastructure outside the vehicle — along with sufficient volume to bring the cost of these combined capabilities down to an affordable price point. In the meantime, ma... » read more

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tag: Siemens EDA

Heterogeneous Integration Finding Its Footing

Why Using Commercial Chiplets Is So Difficult

RISC-V Wants All Your Cores

Do You Really Understand The Importance Of Parasitic Extraction In Chip Designs?

The Value Of Field Solvers In Semiconductor Development Helps Drive Infineon Innovation

Blog Review: October 11

Simplifying Power Module Verification Using Compliance Checking

How Much AI Is Really Needed?

Making Sensors More Reliable

Gearing Up For Level 4 Vehicles

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