Blog Review: April 26

By Jesse Allen - 26 Apr, 2023 - Comments: 0

Codasip's Tora Fridholm introduces the NimbleAI project, an effort to design a neuromorphic sensing and processing 3D integrated chip that implements an always-on sensing stage, highly specialized event-driven processing kernels and neural networks to perform visual inference of selected stimuli using the bare minimum amount of energy. Synopsys' Anjaneya Thakar discusses computational lithog... » read more

IC Security Issues Grow, Solutions Lag

By Ed Sperling - 24 Apr, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the growing chip security threat and what's being done to mitigate it, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker V... » read more

Using AI To Improve Metrology Tooling

By Laura Peters - 17 Apr, 2023 - Comments: 0

Virtual metrology is carefully being added into semiconductor manufacturing, where it is showing positive results, but the chip industry is proceeding cautiously. The first use of this technology has been for augmenting existing fab processes, such as advanced process control (APC). Controlling processes and managing yield generally do not require GPU processing and advanced algorithms, so t... » read more

Thermal Integrity Challenges Grow In 2.5D

By Ann Mutschler - 13 Apr, 2023 - Comments: 3

Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

Unblocking The Full Potential Of PCIe Gen6 With Shared Flow Control

By Vidushi Goel - 13 Apr, 2023 - Comments: 0

As technology advances at a rapid pace, PCI Express (or PCIe) has grown tremendously, allowing data transfer up to 64 GT/s in Gen6. This technology is widely used in data centers, artificial intelligence and machine learning computing, high-performance computing accelerators, and high-speed applications—including high-end SSDs, automotive, IoT, and mil-aero. To fully utilize this high-spee... » read more

RISC-V Driving New Verification Concepts

By Brian Bailey - 12 Apr, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss gaps in tools and why new methodologies are needed for RISC-V processors, with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, ... » read more

Effective Resource Utilization In PCIe Gen6: Shared Flow Control

By Siemens EDA - 12 Apr, 2023 - Comments: 0

In PCIe 6.0, the data rate has doubled from 32 GT/s to 64 GT/s. This technology is a cost-effective and scalable interconnect solution that will continue to impact data-intensive markets and applications while maintaining backward compatibility with all previous generations of PCIe. Data-intensive uses include data centers, artificial intelligence/machine learning computing, high-performance co... » read more

Chiplet Security Risks Underestimated

By Ann Mutschler - 06 Apr, 2023 - Comments: 0

The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Growing Challenges For Increasingly Connected Vehicles

By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

Chip Monitoring For Max Performance And Security

By Lee Harrison - 06 Apr, 2023 - Comments: 0

In a semiconductor market dominated by SoCs for high-performance computing, AI, automotive and 5G, semiconductor companies face myriad challenges and device requirements. The specific challenges for any given SoC vary but can include issues around performance debug and security against hacking. Top of the list includes the need to ensure quality, enhance safety, optimize performance, and increa... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Siemens EDA

Blog Review: April 26

IC Security Issues Grow, Solutions Lag

Using AI To Improve Metrology Tooling

Thermal Integrity Challenges Grow In 2.5D

Unblocking The Full Potential Of PCIe Gen6 With Shared Flow Control

RISC-V Driving New Verification Concepts

Effective Resource Utilization In PCIe Gen6: Shared Flow Control

Chiplet Security Risks Underestimated

Growing Challenges For Increasingly Connected Vehicles

Chip Monitoring For Max Performance And Security

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Knowledge Centers
Entities, people and technologies explored