tag: Siemens EDA

Integration Of S-Parameters For Power Module Verification Into The Engineers’ Design Environment
By Wilfried Wessel - 07 Sep, 2023 - Comments: 0

By Wilfried Wessel (Siemens EDA), Simon Liebetegger (University of Applied Sciences Darmstadt), and Florian Bauer (Siemens EDA) Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily dependent on physical prototypes. The reason for this is the unique s... » read more

Speeding Time-To-Market With A Comprehensive And Tightly Integrated Design And Verification Process
By Siemens EDA - 06 Sep, 2023 - Comments: 0

Nobo Automotive Technology Co., Ltd. is a high-tech automotive electronics company under the Nobo Automotive group, focusing on intelligent cockpit, vehicle control, connectivity, and driving. Its range of products include cabin domain controllers, displays, instrument clusters, infotainment systems, central electronic units, T-Box terminals, and driving domain controllers, among others. Nobo A... » read more

Blog Review: September 6
By Jesse Allen - 06 Sep, 2023 - Comments: 0

Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Blog Review: August 30
By Jesse Allen - 30 Aug, 2023 - Comments: 0

Siemens' Dan Yu examines hallucinations in large language models, the Universal Approximation Theorem, and the role they play in applying LLMs to EDA. Cadence's Mamta Rana introduces shared flow control in PCIe 6.0, which enables the reduced cost implementation of multiple virtual channels by allowing common sets of resources to be shared. Synopsys' Arturo Salz and Johannes Stahl note tha... » read more

New Concepts Required For Security Verification
By Brian Bailey - 28 Aug, 2023 - Comments: 0

Verification for security requires new practices in both the development and verification flows, but tools and methodologies to enable this are rudimentary today. Flows are becoming more complex, especially when they span multiple development groups. Security is special in that it is pervasive throughout the development process, requiring both positive and negative verification. Positive ver... » read more

Optimizing IC Designs For Real-World Use Cases
By Brian Bailey - 24 Aug, 2023 - Comments: 0

Semiconductor systems are becoming more focused on power, performance, and area for the primary scenarios they are likely to see in real-world applications, but increasingly at the expense of secondary tasks. This is happening at all levels of abstraction and all stages of the design flow. At the highest level, processors are being optimized to run a given set of software. RISC-V is one of t... » read more

AI, Rising Chip Complexity Complicate Prototyping
By Karen Heyman - 24 Aug, 2023 - Comments: 0

Prototyping, an essential technology for designing complex chips in tight market windows, is becoming significantly more challenging for the growing number of designs that include AI/ML. Prototyping remains one of the foundational pillars of the whole shift left movement, allowing software to be developed and tested before actual silicon is available. That, in turn, enables multiple teams t... » read more

Why Shift Left?
By Michael White - 24 Aug, 2023 - Comments: 0

As every integrated circuit (IC) design company knows, the faster a design can progress from implementation to signoff verification, the better the chances are of meeting tapeout schedules. Meeting tapeout schedules improves a company’s chances of reaching their market targets. But as companies create larger and more complex ICs and move to advanced process nodes, the challenge of achieving t... » read more

Preparing For Commercial Chiplets
By Ed Sperling - 24 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the path to commercialization of chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts of tha... » read more

The Four Foundational Pillars Of Calibre Shift Left Solutions For IC Design And Implementation Flows
By Siemens EDA - 23 Aug, 2023 - Comments: 0

As the semiconductor industry approaches a new era of digital transformation, design companies everywhere are turning to shift left strategies to address challenges that reduce design cycles while maximizing productivity, optimizing resource efficiency, ensuring design quality, and accelerating time to market. To overcome these challenges in IC design, Calibre shift left technologies include to... » read more

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