Navigating The Intersection Of Safety And Security

By Rambus - 01 Jun, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Blog Review: June 1

By Jesse Allen - 01 Jun, 2022 - Comments: 0

Analog Photonics' Erman Timurdogan, Ren-Jye Shiue, and Mohammad H. Teimourpour, and Ansys' Bozidar Novakovic, Ahsan Alam, and Peter Hallschmid consider the development of photonic process design kits and the importance of choosing a laser model that can optimally satisfy often conflicting requirements between the number of known laser parameters, the model accuracy, and the computational time. ... » read more

Who Benefits From Chiplets, And When

By Ed Sperling - 31 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

How To Optimize A Processor

By Brian Bailey - 26 May, 2022 - Comments: 0

Optimizing any system is a multi-layered problem, but when it involves a processor there are at least three levels to consider. Architects must be capable of thinking across these boundaries because the role of each of the layers must be both understood and balanced. The first level of potential optimization is at the system level. For example, how does data come in and out of the processing... » read more

Will Big Competition Attract More Talent For IC Companies?

By Marie C. Baca - 26 May, 2022 - Comments: 1

Google is hiring a chip packaging technologist. General Motors is seeking a wafer fabrication procurement specialist. Facebook Reality Labs wants a materials researcher with experience in photolithography and nanoimprint techniques. Recent job postings by tech and automotive giants are enough to worry any chip company executive struggling to attract talent. But what may seem at first like a ... » read more

The Evolving Digital Journey Of The Electronics Value Chain

By Matt Walsh - 26 May, 2022 - Comments: 0

Digitally transforming how the electronics value chain is traversed will unlock the full innovative potential of system design companies all over the world. By augmenting desktop authoring tools with integrated, native cloud applications that seamlessly connect companies with the electronics value chain, design teams will be empowered to confidently deliver on aggressive requirements, schedules... » read more

High-Level Synthesis: It’s Still Hardware Design

By Siemens EDA - 26 May, 2022 - Comments: 0

Hardware design using HLS is no different than the typical ASIC/FPGA design flow with the exception that C++/SystemC is being used along with HLS to create the RTL instead of hand coding it. The advantage of using HLS is that it speeds up RTL creation time and reduces verification time by producing bug free RTL quickly from a fully verified C++/SystemC source. The misconception that still exist... » read more

Standardizing Chiplet Interconnects

By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

New End Markets, More Demand For Complex Chips

By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

DRAM Choices Becoming Central Design Considerations

By Ann Mutschler - 12 May, 2022 - Comments: 0

Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory to a critical design element that can affect system performance, power, and cost. These are increasingly important issues to sort through with a number of tradeoffs, but the general consensus is that to reach the higher levels of performance ... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

tag: Siemens EDA