Defining Chip Threat Models To Identify Security Risks


Experts At The Table: As hardware weaknesses have become a major target for attackers, the race to find new ways to strengthen chip security has begun to heat up. But one-size does not fit all solution. To figure out what measures need to be taken, a proper threat model must be assessed. Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San Franci... » read more

Where Power Savings Really Count


Experts at the Table: Semiconductor Engineering sat down to discuss why and where improvements in architectures and data movement will have the biggest impact, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice presi... » read more

Blog Review: July 31


Cadence's Jasmine Makhija explains how to boost the performance of CXL 3.0 by using NOP (No Operation) Insertion Hints in latency-optimized 256B Flit Mode, which enables the system to quickly revert to the low-latency path after temporarily switching to a higher-latency path due to error correction needs. Synopsys' Robert Fey finds that by automatically and dynamically linking requirements a... » read more

Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity


By Michael Walsh and Jin Hou with Todd Burkholder The heterogeneous integration of multiple ICs in a single package along with high-performance, high-bandwidth memory is critical for many high-performance computing applications. After everything has been heterogeneously integrated and packaged, such designs feature complex connectivity with many hundreds of thousands of connections, making i... » read more

Floor-Planning Evolves Into The Chiplet Era


3D-ICs and heterogeneous chiplets will require significant changes in physical layout tools, where the placement of chiplets and routing of signals can have a big impact on overall system performance and reliability. EDA vendors are well aware of the issues and working on solutions. Top on the list of challenges for 3D-ICs is thermal dissipation. Logic typically generates the most heat, and ... » read more

What’s Next In System-Level Design?


Experts At The Table: EDA has undergone numerous workflow changes over time. Different skill sets have come into play over the years, and at times this changed the definition of what it means to design at the system level. Semiconductor Engineering sat down to discuss what this means for designers today, and what the impact will be in the future, with Michal Siwinski, chief marketing officer at... » read more

Heat-Related Issues Impact Reliability In Advanced IC Designs


Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads. All types of circuitry are vulnerable to thermal effects. It can slow the movement of the electrons through wires, cause electromigration that shortens the lifespan of... » read more

A Guide To Rigid-Flex PCB Design


In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance or reliability. Mastering rigid-flex PCB design can be challenging due to its unique requirements. Whether you're an experienced designer expanding your skills or new to the field, this ar... » read more

Data Center Thermal Management Improves


Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

Rigid-Flex PCB Design Guidelines


This white paper is designed to guide you through the intricacies of rigid-flex printed circuit board (PCB) design. In today's electronics industry, there has never been more demand for compact, efficient, and versatile PCBs. Rigid-flex technology has emerged as a game-changer, offering engineers the flexibility to design boards that can bend and flex without sacrificing performance or reliabil... » read more

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