tag: Siemens

Managing P/P Tradeoffs With Voltage Droop Gets Trickier
By Ann Mutschler - 14 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about voltage droop/IR drop with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight Technologies; Venkatesh Santhanagopalan, product manager at Movellus; Joe Davis, senior director for Calibre interfaces and mPower EM/IR... » read more

Automotive Complexity, Supply Chain Strength Demands Tech Collaboration
By Ann Mutschler - 30 Aug, 2023 - Comments: 1

The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers and their suppliers in ways that would have seemed unimaginable even a couple of years ago. Rather than just developing parts for a tightly defined specification, suppliers are taking an increasingly active role in determining how various technologies are combined, w... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 25 Aug, 2023 - Comments: 0

The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027.  In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 11 Aug, 2023 - Comments: 0

Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

Blog Review: Aug. 9
By Jesse Allen - 09 Aug, 2023 - Comments: 0

Synopsys' John Swanson and Manmeet Walia note that designing for 224G Ethernet will entail some unique considerations, as design margins will be extremely tight, making it mission-critical to optimize individual analog blocks to reduce impairments. Cadence's Rick Sanborn finds that knowing how best to debug common partitioning-related issues and implicitly control them using common features ... » read more

Creating IP In The Shadow Of ISO 26262
By Karen Heyman - 03 Aug, 2023 - Comments: 0

On many levels, designing IP for the automotive sector is similar to targeting aerospace or medical devices — human lives are at risk if something goes wrong, and the list of regulations is significant. In practice, it can turn an interesting chip design project into a complex and often frustrating checklist exercise. In the case of ISO 26262, that includes a 12-part standard for automotiv... » read more

Week In Review: Design, Low Power
By Susan Rambo - 28 Jul, 2023 - Comments: 0

Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

The Good And Bad Of Chip Design On Cloud
By Ann Mutschler - 27 Jul, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about how the shift toward chip design on cloud has sped up, whether the benefits of cloud are realized in chip design, and some of the most pressing challenges to chip design on cloud today, with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Syst... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

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