tag: Siemens

Performance and Power Tradeoffs At 7/5nm
By Ed Sperling - 27 Oct, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

Regaining The Edge In U.S. Chip Manufacturing
By Mark LaPedus & Ann Steffora Mutschler - 26 Oct, 2020 - Comments: 16

The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

Blog Review: Oct. 21
By Jesse Allen - 21 Oct, 2020 - Comments: 0

Rambus' Frank Ferro and IDC's Shane Rau compare the evolution of HBM and GDDR6, as well as the design tradeoffs and challenges of the two memory types. Mentor's Neil Johnson compares unit testing and formal property checking as first steps for verifying low-level RTL functionality. Synopsys' Patrick Carey considers the competing demands of delivering a product as soon as possible and maki... » read more

Increase In Analog Problems
By Brian Bailey - 19 Oct, 2020 - Comments: 6

Analog and mixed signal design has always been tough, but a resent survey suggests that the industry has seen significantly increased failures in the past year because the analog circuitry within an ASIC was out of tolerance. What is causing this spike in failures? Is it just a glitch in the data, or are these problems real? The answer is complicated, and to a large extent it depends heavily... » read more

Machine Learning Enabled High-Sigma Verification Of Memory Designs
By Nebabie Kebebew - 15 Oct, 2020 - Comments: 0

Emerging applications and the big data explosion have made memory IPs ubiquitous in modern-day electronics. Specifically, the demand for memories with low-die area, low voltage, high capacity, and high performance is rising for use by data center and cloud computing servers. This is essential to serve the exponentially growing connectivity boom and the latest emerging 5G based systems, includin... » read more

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

SystemVerilog Constraints
By Mentor, a Siemens Business - 14 Oct, 2020 - Comments: 0

This paper looks at two of the most common issues when constraint solver results do not match your intent: Not understanding how Verilog expression evaluation rules apply to interpret the rules of basic algebra and not understanding the affect probability has on choosing solution values. Coding recommendations for improving your code to get better results are provided. To read more, click here. » read more

Blog Review: Oct. 14
By Jesse Allen - 14 Oct, 2020 - Comments: 0

Arm's Hongsup Shin explains a machine learning application that can determine which tests are most likely to find hardware bugs, improving efficiency and reducing the number of tests that need to be run. Synopsys' Pieter van der Wolf and Dmitry Zakharov take a look at the increasing need for low power processors optimized for machine learning tasks as IoT, smart home, and wearable devices pr... » read more

Secure Silicon Lifecycle Management Architecture For Functional Safety
By Lee Harrison - 08 Oct, 2020 - Comments: 0

The rapid growth of electronics for automotive applications fueled by advanced ADAS systems pose new challenges for complex SoC design and Silicon Lifecycle Management (SLM) in the supply chain as well as in-field monitoring and management of the population of chips. In these modern complex devices, ensuring the correct and safe operation requires not only functional safety to check for reli... » read more

Sensor Fusion Challenges In Cars
By Ann Mutschler - 08 Oct, 2020 - Comments: 0

The automotive industry is zeroing in on sensor fusion as the best option for dealing with the complexity and reliability needed for increasingly autonomous vehicles, setting the stage for yet another shift in how data from multiple devices is managed and utilized inside a vehicle. The move toward greater autonomy has proved significantly more complicated than anyone expected at first. There... » read more

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