Rocky Road To Designing Chips In The Cloud

By Ann Mutschler - 24 Jun, 2021 - Comments: 0

EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 11 Jun, 2021 - Comments: 0

Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

RISC-V Targets Data Centers

By Ann Mutschler - 22 Apr, 2021 - Comments: 0

RISC-V vendors are beginning to aim much higher in the compute hierarchy, targeting data centers and supercomputers rather than just simple embedded applications on the edge. In the past, this would have been nearly impossible for a new instruction set architecture. But a growing focus on heterogeneous chip integration, combined with the reduced benefits of scaling and increasing demand for ... » read more

RISC-V Verification Challenges Spread

By Ann Mutschler - 22 Dec, 2020 - Comments: 0

The RISC-V ecosystem is struggling to keep pace with rapid innovation and customization, which is increasing the amount of verification work required for each design and spreading that work out across more engineers at more companies. The historical assumption is that verification represents 60% to 80% or more of SoC project effort in terms of cost and time for a mature, mainstream processor... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 18 Sep, 2020 - Comments: 0

Chipmakers and OEMs Apple has launched a new Apple Watch and iPad. Missing from the announcement was the iPhone 12, which may appear next month, according to Krish Sankar, an analyst at Cowen. What was interesting about this week’s announcement? Apple unveiled the iPad Air with the A14 Bionic, Apple’s most advanced chip. “Apple revealed the new 8th gen iPad (starting at $329) powered by ... » read more

Startup Funding: August 2020

By Jesse Allen - 02 Sep, 2020 - Comments: 0

Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

RISC-V’s Expanding Footprint

By Ed Sperling - 27 Aug, 2020 - Comments: 0

Zdenek Prikryl, CTO of Codasip, sat down with Semiconductor Engineering to talk about the RISC-V market, where this open instruction set architecture (ISA) is gaining ground, and what are the biggest challenges in working with this technology. SE: Where do you see the value in RISC-V? Is it for off-the-shelf processors or more customized components? Prikryl: A few years ago, RISC-V was us... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 Aug, 2020 - Comments: 0

Tools & IP SiFive announced OpenFive, a self-contained and autonomous business unit that will offer custom silicon solutions with differentiated IP. OpenFive will be led by Dr. Shafy Eltoukhy, SVP, and general manager of OpenFive. OpenFive debuted with a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chipset based designs for networking, HPC, and AI markets. The D2D p... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 14 Aug, 2020 - Comments: 0

Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel announced some new enhancements for its existing 10nm finFET technology. Basically, it’s a mid-life kicker for the technology. Intel calls it the 10nm SuperFin technology, which is a redefinitio... » read more

Creating Better Models For Software And Hardware Verification

By Ed Sperling - 04 Aug, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss what's ahead for verification with Daniel Schostak, Arm fellow and verification architect; Ty Garibay, vice president of hardware engineering at Mythic; Balachandran Rajendran, CTO at Dell EMC; Saad Godil, director of applied deep learning research at Nvidia; Nasr Ullah, senior director of performance architecture at SiFive. What follows are excerpt... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SiFive

Rocky Road To Designing Chips In The Cloud

Week In Review: Manufacturing, Test

RISC-V Targets Data Centers

RISC-V Verification Challenges Spread

Week In Review: Manufacturing, Test

Startup Funding: August 2020

RISC-V’s Expanding Footprint

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

Creating Better Models For Software And Hardware Verification