The Week In Review: IoT

By Jeff Dorsch - 25 Aug, 2017 - Comments: 0

Deals Advanced Semiconductor Engineering was selected by zGlue as its strategic manufacturing partner. The ASE Group will make the zGlue Integrated Platform, which is said to enable customization for consumer and industrial IoT markets. The ZiP integrates hardware and software in a modular 3DIC-based platform. ASE will assemble zGlue-certified chiplets for connecting through zGlue Smart Fabric... » read more

Stepping Back From Scaling

By Ed Sperling - 24 Aug, 2016 - Comments: 0

Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

2.5D Creeps Into SoC Designs

By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

One-On-One: Mark Bohr

By Mark LaPedus - 18 Sep, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss process technology, transistor trends, chip-packaging and other topics with Mark Bohr, a senior fellow and director of process architecture and integration at Intel. SE: Intel recently introduced chips based on its new 14nm process. Can you briefly describe the 14nm process? Bohr: It’s our second-generation, tri-gate technology. So it has al... » read more

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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tag: silicon interposers

The Week In Review: IoT

Stepping Back From Scaling

2.5D Creeps Into SoC Designs

One-On-One: Mark Bohr