中文 English

MIPI DSI-2 With VESA DSC Drives Performance For Next-Generation Displays


The Mobile Industry Processor Interface (MIPI) Alliance was formed in 2003 to address the fragmentation in the essential video interface technologies for cameras and displays in phones. Over the years, the alliance has significantly expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip, control/data, and debug/trace and software. With its broader mission... » read more

Modernizing Audio Codec Industry Standards For Enhanced Power Savings And Performance


Mobile phones have become a necessity, and we all use them to talk, play, communicate, and manage many aspects of our lives. While you may have an iPhone, your friends might have an Android phone  from one of several vendors. They all look and feel different, yet you can seamlessly talk with your friends. How is that possible? While they are different in some ways, they are similar in many oth... » read more

Week In Review: Manufacturing, Test


Fab tools, materials and packaging Intel has recognized 37 companies for its annual suppliers’ awards. The list includes equipment, materials, packaging houses and other segments. These suppliers have collaborated with Intel to implement process improvements with good products and services. See who made the list here. ---------------------------------------- Lam Research has introduced... » read more

Chips, Business And The Coronavirus


In the spring of 2003, the SARS (severe acute respiratory syndrome) hit China and Hong Kong, creating such panic that no one would touch crates on shipping docks. Ultimately, it erased an estimated $40 billion from the global economy and effectively shut down the Chinese semiconductor industry for several months. It could have been much worse, though, and this is what is particularly troubli... » read more

RF GaN Gains Steam


Wide-bandgap semiconductors are hot topics these days. One wide-bandgap semi type--silicon carbide (SiC)--is the talk of the town and is gaining steam in electric vehicles and other systems. But let’s not forget about gallium nitride (GaN). GaN, a binary III-V material, has 10 times the breakdown field strength with double the electron mobility than silicon. GaN is used for LEDs, power ... » read more

Week In Review: Manufacturing, Test


Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Week in Review – IoT, Security, Autos


Products/Services Rambus entered an exclusive agreement to acquire the Silicon IP, Secure Protocols, and Provisioning business from Verimatrix, formerly known as Inside Secure. Financial terms were not revealed. The transaction is expected to close this year. Rambus will use the Verimatrix offerings in such demanding applications as artificial intelligence, automotive, the Internet of Things, ... » read more

Week in Review: IoT, Security, Autos


Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Speed Returns As The Key Metric


For the foreseeable future, it's all about performance. For the past decade or so, power and battery life have been the defining characteristics of chip design. Performance was second to those. This was particularly important in smart phones and wearable devices, where time between charges was a key selling point. In fact, power-hungry processors killed the first round of smart watches. But ... » read more

← Older posts