Experts At The Table: SoC Prototyping


By Ann Steffora Mutschler System-Level Design sat down to discuss SoC prototyping with Hillel Miller, pre-silicon verification/emulation manager at Freescale Semiconductor; Frank Schirrmeister, group director, product marketing, system development suite at Cadence; and Mick Posner, director of product marketing at Synopsys. What follows are excerpts of that conversation. SLD: Is it possib... » read more

New Reliability Issues Emerge


By Ed Sperling Most consumers define reliability by whether a device turns on and works as planned, but the term is becoming harder to define as complexity increases and systems are interconnected. Adding more functionality in less space has made it more difficult to build complex chips, and it has made it more difficult to prevent problems in those chips. Verification coverage is a persist... » read more

Drowning In Data


By Ed Sperling The old adage, “Be careful what you wish for,” has hit the SoC design market like a 100-year storm. After years of demanding more data to understand what’s going on in a design, engineering teams now have so much data that they’re drowning in it. This is most obvious at advanced process nodes, of course. But it’s also true these days at more mainstream nodes such as... » read more

Apple’s Big Breakthrough


By Cary Chin For literally years now, we’ve talked about and measured energy consumption as smartphones have morphed from primarily communications devices (voice), to the world’s most widespread computing platform, and back again to a communications focus. But this time it’s data communications, and voice calls are just a small subset. Smartphones themselves, once the defining standar... » read more

The Week In Review: May 31


By Ed Sperling Mentor Graphics and GlobalFoundries teamed up to deliver 20nm design kits that include Mentor’s place and route tool, including verification and conflict resolution engines for double-patterning violations. The 20nm process is used for GlobalFoundries’ 14nm finFETs. Mentor also received 16nm finFET certification from TSMC for the same tools plus its physical verification pl... » read more

The (R)evolution Of Intelligent IP Subsystems


IP subsystems have gone from talking point to reality in a very short period of time, but most coverage focuses on a hardware integrators view. The system integrator’s view is very different because the task of software integration is now vastly more complex dealing with software from multiple providers, using different assumptions and with different requirements. This effort, already larger ... » read more

Software, From Zero To Hero


By Tom De Schutter As the amount of software in electronics applications continues to grow across many markets, from mobile phones to automotive hybrid systems, it is interesting to see how people portray this new-found dependency on software availability. I recently saw a presentation slide with the title: software delays products. Well, that’s one way of looking at it, but it’s a rather ... » read more

Experts At The Table: FinFET Questions And Issues


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the current state and future promise of finFETs, and the myriad challenges, with Ruggero Castagnetti, an LSI fellow; Barry Pangrle, senior power methodology engineer at Nvidia; Steve Carlson, group director of marketing at Cadence; and Mary Ann White, director of product marketing at Synopsys. What follows are excerpts o... » read more

Beyond Software: The Virtual-Machine Supply System


It’s no secret that EDA and IP companies have had to expand their coverage into the larger system market, thanks to changes in the semiconductor supply chain. Around 2000, the industry was very fragmented. Mobile-chip and IP vendors worked with handset makers, who then partnered with operating-system (OS) suppliers and finally network operators. The next 12 years resulted in various combinati... » read more

Taking Aim At Big Data


By Ed Sperling As the Internet of Things bridges the gap between the mobile and big data worlds, EDA and IP vendors increasingly are looking well beyond their usual boundaries. How successful they are at moving upward into a market that is far less price-sensitive remains to be seen. But from a technology standpoint, at least, the issues encountered by data centers and cloud providers are ... » read more

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